The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Sep. 13, 2022
Applicant:
Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;
Inventors:
Shou-Zen Chang, Hsinchu, TW;
Mei Ling Ho, Hsinchu County, TW;
Tien-Lu Lin, Hsinchu, TW;
Ming-Han Liao, Hsinchu, TW;
Chia-Ming Wu, Hsinchu, TW;
Jui-Neng Tu, Hsinchu County, TW;
Assignee:
Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53242 (2013.01); H01L 23/53252 (2013.01); H01L 23/53257 (2013.01); H01L 23/53266 (2013.01);
Abstract
An interconnect structure including a dielectric structure, plugs, and conductive lines is provided. The dielectric structure is disposed on a substrate. The plugs are disposed in the dielectric structure. The conductive lines are disposed in the dielectric structure and are electrically connected to the plugs. The sidewall of at least one of the conductive lines is in direct contact with the dielectric structure.