The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2025

Filed:

Mar. 10, 2022
Applicant:

Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;

Inventors:

Shou-Zen Chang, Hsinchu, TW;

Ming-Han Liao, Hsinchu, TW;

Min-Cheng Chen, Hsinchu County, TW;

Hiroshi Yoshida, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 51/20 (2023.01); G11C 11/22 (2006.01); H01L 23/528 (2006.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H10B 51/20 (2023.02); G11C 11/221 (2013.01); G11C 11/2273 (2013.01); G11C 11/2275 (2013.01); H01L 23/5283 (2013.01); H10D 30/6755 (2025.01);
Abstract

A 3D monolithic stacking memory structure is provided in the present invention, including a semiconductor substrate, a field effect transistor (FET) on the semiconductor substrate, a plurality of back-end metal layers on the FET and the semiconductor substrate, an oxide-semiconductor FET (OSFET) in the back-end metal layers, wherein a drain of the OSFET is connected with a gate of the FET, and a FEMIM storage capacitor formed on the back-end metal layers, wherein a bottom electrode of the FEMIM storage capacitor is connected with the drain of the OSFET and the gate of the FET, and the FET, the OSFET and the FEMIM storage capacitor are stacked in order from bottom to top on the semiconductor substrate.


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