The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Jun. 08, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Sheng-Huan Chiu, Taichung, TW;
Chun-Jen Chen, Hsinchu County, TW;
Chen-Shien Chen, Hsinchu County, TW;
Kuo-Chio Liu, Hsinchu, TW;
Kuo-Hui Chang, Taoyuan, TW;
Chung-Yi Lin, Hsinchu, TW;
Hsi-Kuei Cheng, Hsinchu County, TW;
Yi-Jen Lai, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.