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For the Inventor, By the Inventor

Jhubei, Taiwan

Chun-Jen Chen

USPTO Granted Patents = 39 

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 61(Granted Patents)


Location History:

  • Taipei County, TW (2011)
  • Sanchong, TW (2011)
  • Renwu Township, TW (2015 - 2016)
  • Renwu Township, Kaohsiung County, TW (2013 - 2017)
  • Jhubei, Hsinchu County, TW (2017)
  • Zhubei, TW (2013 - 2020)
  • Jhubei, TW (2015 - 2022)
  • Hsinchu, TW (2018 - 2022)
  • Hsinchu County, TW (2012 - 2024)
  • Kaohsiung, TW (2013 - 2024)

Company Filing History:

goldMedal27 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal8 out of 9,152 
 
Industrial Technology Research Institute
 patents
bronzeMedal4 out of 1,872 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2011-2025

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39 patents (USPTO):Explore Patents
1. 12482763 - Semiconductor device package and methods of formation (2025-11-25),
2. 12444647 - Electron migration control in interconnect structures (2025-10-14),
3. 12401387 - Electronic module (2025-08-26),
4. 12394735 - Shifting contact pad for reducing stress (2025-08-19),
5. 12354907 - Electron migration control in interconnect structures (2025-07-08),
6. 12176297 - Semiconductor device package (2024-12-24),
7. 12051634 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2024-07-30),
8. 11876551 - Electronic module (2024-01-16),
9. 11756849 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2023-09-12),
10. 11488891 - Method of forming conductive bumps for cooling device connection and semiconductor device (2022-11-01),
11. 11404341 - Package and package-on-package structure having elliptical columns and ellipsoid joint terminals (2022-08-02),
12. 11302646 - Semiconductor device package (2022-04-12),
13. 11264273 - Electron migration control in interconnect structures (2022-03-01),
14. 11217548 - Semiconductor device structure and manufacturing method (2022-01-04),
15. 11145613 - Method for forming bump structure (2021-10-12),

Title: Inventor Chun-Jen Chen: Revolutionizing Technology in Jhubei

Introduction: Chun-Jen Chen, a visionary inventor hailing from Jhubei, Taiwan, is a prominent figure in the world of technology and innovation.

Latest Patents: Chun-Jen Chen holds several groundbreaking patents in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Chen has worked with leading tech companies and research institutions, contributing significantly to the development of cutting-edge technologies that have shaped industries worldwide.

Collaborations: Known for his collaborative spirit, Chun-Jen Chen has partnered with top universities and multinational corporations to drive innovation and bring revolutionary ideas to life through strategic partnerships and joint ventures.

Conclusion: Chun-Jen Chen's relentless pursuit of innovation and his passion for pushing the boundaries of technology continue to inspire the next generation of inventors and entrepreneurs globally.

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