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Kaohsiung, Taiwan

Advanced Semiconductor Engineering, Inc.

USPTO Granted Patents = 1,870

EPO Patents = 1

Trademarks = 14

Forward Citations = 12,791

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1,192 inventors (with patents filed for the assignee):

Wen-Long Lu (79 out of 79 patents)

Su Tao (73 out of 77 patents)

Chih-Cheng Lee (66 out of 67 patents)

4. Wen Hung Huang (54 out of 64 patents)

5. Chih-Pin Hung (54 out of 55 patents)

6. Meng-Jen Wang (50 out of 50 patents)

7. Min-Lung Huang (50 out of 50 patents)

8. Lu-Ming Lai (45 out of 46 patents)

9. Jen-Kuang Fang (45 out of 46 patents)

10. You-Lung Yen (40 out of 40 patents)

11. Kuang-Hsiung Chen (40 out of 41 patents)

12. Teck-Chong Lee (39 out of 40 patents)

13. Bernd Karl Appelt (39 out of 39 patents)

14. Chang-Lin Yeh (37 out of 37 patents)

15. Chun-Chi Lee (36 out of 36 patents)

Core Competencies:

Semiconductor Package Structure

Electronic Device Package

Optoelectronic Package

Wearable Device

Antenna Package Structure

Optical Module

Electronic Module

Body-Part Tracking Device

Wiring Structure

Electronic Assembly

Temperature Detection Method

Substrate Structure

1,870 patents: Sort by Forward Citations

1. 12495655 - Optoelectronic package structure and method of manufacturing the same (2025-12-09),

2. 12494446 - Package structures and methods of manufacturing the same (2025-12-09),

3. 12494437 - Substrate structure including different size of electronic component (2025-12-09),

4. 12489223 - Electronic device (2025-12-02),

5. 12484848 - Detection module (2025-12-02),

6. 12482694 - Electronic package and suction device (2025-11-25),

7. 12476177 - Semiconductor package structure (2025-11-18),

8. 12469795 - Substrate structure including embedded semiconductor device and method of manufacturing the same (2025-11-11),

9. 12463157 - Electronic package (2025-11-04),

10. 12463141 - Semiconductor substrate, semiconductor package, method of manufacturing the same (2025-11-04),

11. 12451415 - Semiconductor device package, electronic assembly and method for manufacturing the same (2025-10-21),

12. 12444848 - Electronic device (2025-10-14),

13. 12444689 - Semiconductor package and method of manufacturing the same (2025-10-14),

14. 12443246 - Electronic device (2025-10-14),

15. 12438128 - Semiconductor device package (2025-10-07),

Advanced Semiconductor Engineering, Inc. (ASE) is a leading provider of semiconductor manufacturing services and test solutions. With an established presence in the industry for over three decades, ASE offers a comprehensive range of services including IC packaging, testing, design, and materials. The company serves customers in various sectors such as communications, consumer electronics, automotive, and more. ASE is committed to delivering innovative and reliable solutions to enable its customers' success in the ever-evolving semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

1,870 Patents

#1 in Kaohsiung

#16 in Taiwan

#522 in the World

Kaohsiung, Taiwan

Advanced Semiconductor Engineering, Inc.

Forward Citations = 12,791

1,192 inventors:

Wen-Long Lu (79 out of 79 patents)

Su Tao (73 out of 77 patents)

Chih-Cheng Lee (66 out of 67 patents)

4. Wen Hung Huang (54 out of 64 patents)

5. Chih-Pin Hung (54 out of 55 patents)

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