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Kaohsiung, Taiwan

Wen Hung Huang

USPTO Granted Patents = 64 (Patent Applications = 37)

Average Co-Inventor Count = 1.4

ph-index = 3

Forward Citations = 47(Granted Patents)

Forward Citations (Not Self Cited) = 34(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Tainan, TW (2004 - 2005)
Kaohsiung, TW (2018 - 2024)
Kaosiung, TW (2024)

Company Filing History:

54 out of 1,874

Advanced Semiconductor Engineering, Inc.

1 out of 832,891

Other

patents

where one patent can have more than one assignee

Years Active: 2004-2025

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Areas of Expertise:

Semiconductor Substrate

Semiconductor Package

Wiring Structure

Stress Buffering Layer

Dielectric Protection

Conductive Structures

Wafer Level Packaging

Electronic Devices

Stacked Structures

Circuit Structures

Manufacturing Methods

Package Structures

64 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12494448 - UBM-free metal skeleton frame with support studs and method for fabrication thereof (2025-12-09),

2. 12463141 - Semiconductor substrate, semiconductor package, method of manufacturing the same (2025-11-04),

3. 12406951 - Redistribution layer having a sideview zig-zag profile (2025-09-02),

4. 12315820 - Wiring structure including low- and high-density conductive structures (2025-05-27),

5. 12315797 - Semiconductor substrate structure and method of manufacturing the same (2025-05-27),

6. 12300677 - Semiconductor device package including stress buffering layer (2025-05-13),

7. 12249585 - Semiconductor device package (2025-03-11),

8. 12198998 - Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process (2025-01-14),

9. 12080601 - Packaged semiconductor devices and methods therefor (2024-09-03),

10. 12021044 - Semiconductor device package and method of manufacturing the same (2024-06-25),

11. 11961799 - Semiconductor substrate structure and method of manufacturing the same (2024-04-16),

12. 11935753 - Backside and sidewall metallization of semiconductor devices (2024-03-19),

13. 11923274 - Semiconductor device package including promoters and method of manufacturing the same (2024-03-05),

14. 11908815 - Semiconductor device package (2024-02-20),

15. 11894293 - Circuit structure and electronic structure (2024-02-06),

Title: The Innovative Journey of Wen Hung Huang

Introduction: Wen Hung Huang, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Wen Hung Huang's latest patents showcase his continuous dedication to pushing the boundaries of technology and creativity, with a focus on improving everyday life through his inventions.

Career Highlights: Throughout his illustrious career, Wen Hung Huang has been recognized for his inventive spirit and has received numerous accolades for his groundbreaking work in various fields such as technology, healthcare, and sustainability.

Collaborations: Wen Hung Huang has collaborated with leading industry experts, research institutions, and universities to further enhance the impact of his inventions and bring them to the global stage, solidifying his reputation as a visionary inventor.

Conclusion: Wen Hung Huang's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of inventions, inspiring future generations to think outside the box and create a better tomorrow through their innovative ideas.

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