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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Wen Hung Huang

This inventor holds 69 USPTO granted patents and 42 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Advanced Semiconductor Engineering, Inc., Nxp B.v., Nxp USA, Inc.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen Hung Huang. Retrieved from https://idiyas.com/inventor/wen-hung-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 69 

% Patents Active = 100.0

Average Co-Inventor Count = 1.4

ph-index = 3

Forward Citations = 53(Granted Patents)

Forward Citations (Not Self Cited) = 34(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Tainan, TW (2004 - 2005)
  • Kaohsiung, TW (2018 - 2024)
  • Kaosiung, TW (2024)

Company Filing History:

goldMedal55 out of 1,962 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal7 out of 5,322 
 
Nxp B.v.
 patents
bronzeMedal3 out of 2,846 
 
Nxp USA, Inc.
 patents
4. 1 out of 834,453 
Other
 patents
where one patent can have more than one assignee

Years Active: 2004-2026

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Areas of Expertise:
Semiconductor Device
Multichip Packages
3D Integration
Wiring Structure
Stress Buffering Layer
Manufacturing Method
Device Structure
Conductive Structures
Substrate Structure
Package Structure
Dielectric Protection
Antenna Integration
69 patents (USPTO):Explore Patents
1. 12622280 - Semiconductor device with through package via and method therefor (2026-05-05),
2. 12588557 - Multichip packages with 3D integration (2026-03-24),
3. 12588538 - Semiconductor device having wired under bump structure and method therefor (2026-03-24),
4. 12557709 - Package structure and method for manufacturing the same (2026-02-17),
5. 12538844 - Double-sided multichip packages (2026-01-27),
6. 12494448 - UBM-free metal skeleton frame with support studs and method for fabrication thereof (2025-12-09),
7. 12463141 - Semiconductor substrate, semiconductor package, method of manufacturing the same (2025-11-04),
8. 12406951 - Redistribution layer having a sideview zig-zag profile (2025-09-02),
9. 12315820 - Wiring structure including low- and high-density conductive structures (2025-05-27),
10. 12315797 - Semiconductor substrate structure and method of manufacturing the same (2025-05-27),
11. 12300677 - Semiconductor device package including stress buffering layer (2025-05-13),
12. 12249585 - Semiconductor device package (2025-03-11),
13. 12198998 - Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process (2025-01-14),
14. 12080601 - Packaged semiconductor devices and methods therefor (2024-09-03),
15. 12021044 - Semiconductor device package and method of manufacturing the same (2024-06-25),

Title: The Innovative Journey of Wen Hung Huang

Introduction: Wen Hung Huang, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Wen Hung Huang's latest patents showcase his continuous dedication to pushing the boundaries of technology and creativity, with a focus on improving everyday life through his inventions.

Career Highlights: Throughout his illustrious career, Wen Hung Huang has been recognized for his inventive spirit and has received numerous accolades for his groundbreaking work in various fields such as technology, healthcare, and sustainability.

Collaborations: Wen Hung Huang has collaborated with leading industry experts, research institutions, and universities to further enhance the impact of his inventions and bring them to the global stage, solidifying his reputation as a visionary inventor.

Conclusion: Wen Hung Huang's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of inventions, inspiring future generations to think outside the box and create a better tomorrow through their innovative ideas.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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