The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Dec. 06, 2022
Nxp Usa, Inc., Austin, TX (US);
Scott M. Hayes, Chandler, AZ (US);
Wen Hung Huang, Kaosiung, TW;
Michael B. Vincent, Chandler, AZ (US);
Antonius Hendrikus Jozef Kamphuis, Nijmegen, NL;
Zhiwei Gong, Chandler, AZ (US);
Leo Van Gemert, Nijmegen, NL;
NXP USA, INC., Austin, TX (US);
Abstract
An electronic device package and method of fabricating such a package includes a first and second components encapsulated in a volume of molding material. A surface of the first component is bonded to a surface of the second component. Upper and lower sets of redistribution lowers that include, respectively, first and second sets of conductive interconnects are formed on opposite sides of the molding material. A through-package interconnect passes through the volume of molding material and has ends that terminate, respectively, within the upper set of redistribution layers and within the lower set of redistribution layers.