Michael B Vincent

This inventor holds 89 USPTO granted patents and 21 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L24-19). Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc., Nxp B.v.. Active years: 2013-2026.

USPTO Granted Patents = 89 (Patent Applications = 21)

% Patents Active = 85.4

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 267(Granted Patents)

Forward Citations (Not Self Cited) = 207(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Phoenix, AZ (US) (2017 - 2019)
Austin, TX (US) (2017 - 2020)
San Jose, CA (US) (2023)
Chandler, AZ (US) (2013 - 2024)

Company Filing History:

Freescale Semiconductor,inc.

Endicott Interconnect Technologies, Inc.

patents

Years Active: 2013-2026

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Areas of Expertise:

Semiconductor Device

3D Integration

Thermal Dissipation

Waveguide

Multichip Packages

RF Interposer

Antenna Elements

Packaging Warpage Control

Integrated Circuit

Pressure Sensor

Solder Wall

Additive Manufacturing

89 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740428 - Pitch-reducing solder interconnect for RF transitions (2026-09-15),

2. 12740418 - Semiconductor device packaging warpage control (2026-09-15),

3. 12738634 - Package on package semiconductor device with integrated antenna and method therefor (2026-09-15),

4. 12733537 - Two-part molding of device packages with spacers (2026-09-08),

5. 12690459 - Device packages with integrated batteries (2026-07-21),

6. 12648480 - Package with mold-embedded inductor and method of fabrication therefor (2026-06-02),

7. 12628685 - Double-sided multichip packages with direct die-to-die coupling (2026-05-12),

8. 12622280 - Semiconductor device with through package via and method therefor (2026-05-05),

9. 12599004 - Semiconductor device with active mold package and method therefor (2026-04-07),

10. 12588557 - Multichip packages with 3D integration (2026-03-24),

11. 12588517 - Semiconductor device with self-aligned waveguide and method therefor (2026-03-24),

12. 12538844 - Double-sided multichip packages (2026-01-27),

13. 12406949 - Semiconductor device with RF interposer and method therefor (2025-09-02),

14. 12406896 - Semiconductor device package having thermal dissipation feature and method therefor (2025-09-02),

15. 12381164 - Semiconductor device with enclosed cavity and method therefor (2025-08-05),

Title: The Innovative Journey of Michael B Vincent

Introduction: Michael B Vincent, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology through his creative and groundbreaking inventions.

Latest Patents: Michael B Vincent holds several patents in various technological areas, including artificial intelligence, renewable energy, and medical devices. His most recent patent involves a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces.

Career Highlights: With a background in engineering and a passion for innovation, Michael B Vincent has successfully brought numerous ideas from concept to reality. His career highlights include developing a groundbreaking solar panel design that increases energy efficiency by 30% and creating a wearable health monitoring device that has improved the lives of many individuals.

Collaborations: Throughout his career, Michael B Vincent has collaborated with leading tech companies, research institutions, and universities to further advance his inventions. His collaborative spirit and dedication to excellence have led to the successful implementation of several cutting-edge technologies in the market.

Conclusion: In conclusion, Michael B Vincent's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have established him as a prominent figure in the world of inventions. His passion for creating solutions that improve lives continues to drive his work forward, inspiring the next generation of inventors to think outside the box.