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Endicott, NY, United States of America

Endicott Interconnect Technologies, Inc.

USPTO Granted Patents = 151

Trademarks = 2

Forward Citations = 1,186

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88 inventors (with patents filed for the assignee):

Voya Rista Markovich (83 out of 252 patents)

John M Lauffer (56 out of 130 patents)

Rabindra N Das (27 out of 32 patents)

4. Frank Daniel Egitto (26 out of 86 patents)

5. How Tzu Lin (22 out of 47 patents)

6. Kostas I Papathomas (18 out of 59 patents)

7. Benson Chan (17 out of 51 patents)

8. Robert Maynard Japp (17 out of 77 patents)

9. David L Thomas (14 out of 24 patents)

10. James J McNamara, Jr (13 out of 13 patents)

11. Irving Memis (9 out of 35 patents)

12. James W Fuller, Jr (9 out of 16 patents)

13. Mark David Poliks (9 out of 49 patents)

14. Timothy Eugene Antesberger (8 out of 14 patents)

15. Varaprasad V Calmidi (8 out of 8 patents)

Core Competencies:

Conductive Adhesives

Circuitized Substrates

High Density Interposer

Multilayer Capacitors

Thermal Interposer

Embedded Capacitance

Flexible Circuit Packages

Photon Counting Electronics

Dielectric Layers

Electrical Assemblies

Solder Interconnections

Thermal Nanofluids

151 patents: Sort by Forward Citations

1. 8685284 - Conducting paste for device level interconnects (2014-04-01),

2. 8607445 - Substrate having internal capacitor and method of making same (2013-12-17),

3. 8592299 - Solder and electrically conductive adhesive based interconnection for CZT crystal attach (2013-11-26),

4. 8558374 - Electronic package with thermal interposer and method of making same (2013-10-15),

5. 8541687 - Coreless layer buildup structure (2013-09-24),

6. 8536459 - Coreless layer buildup structure with LGA (2013-09-17),

7. 8502082 - Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same (2013-08-06),

8. 8501575 - Method of forming multilayer capacitors in a printed circuit substrate (2013-08-06),

9. 8499445 - Method of forming an electrically conductive printed line (2013-08-06),

10. 8499440 - Method of making halogen-free circuitized substrate with reduced thermal expansion (2013-08-06),

11. 8493173 - Method of cavity forming on a buried resistor layer using a fusion bonding process (2013-07-23),

12. 8446707 - Circuitized substrate with low loss capacitive material and method of making same (2013-05-21),

13. 8445094 - Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers (2013-05-21),

14. 8405229 - Electronic package including high density interposer and circuitized substrate assembly utilizing same (2013-03-26),

15. 8354650 - Multi-window signal processing electronics architecture for photon counting with multi-element sensors (2013-01-15),

Endicott Interconnect Technologies, Inc. is a leading provider of advanced electronic packaging solutions. With over 50 years of experience, they specialize in the design, development, and manufacturing of printed circuit boards (PCBs) and other interconnect solutions for various industries. Their wide range of products and services includes high-density interconnect (HDI) technology, flexible circuits, microelectronics assembly, and thermal management solutions. Endicott Interconnect Technologies aims to deliver innovative and reliable solutions that meet the ever-changing needs of their customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

151 Patents

#1 in Endicott, NY

#154 in New York

#2,524 in US

#5,272 in the World

Endicott, NY, United States of America

Endicott Interconnect Technologies, Inc.

Forward Citations = 1,186

88 inventors:

Voya Rista Markovich (83 out of 252 patents)

John M Lauffer (56 out of 130 patents)

Rabindra N Das (27 out of 32 patents)

4. Frank Daniel Egitto (26 out of 86 patents)

5. How Tzu Lin (22 out of 47 patents)

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