Endicott, NY, United States of America
Endicott Interconnect Technologies, Inc.
Patents = 151
Trademarks = 2
Forward Citations = 1,171
where 'Filed Patents' based on already Granted Patents
where 'Inventors Filed' based on already Granted Patents
88 inventors (with patents filed for the assignee):
Endicott Interconnect Technologies, Inc. is a leading provider of advanced electronic packaging solutions. With over 50 years of experience, they specialize in the design, development, and manufacturing of printed circuit boards (PCBs) and other interconnect solutions for various industries. Their wide range of products and services includes high-density interconnect (HDI) technology, flexible circuits, microelectronics assembly, and thermal management solutions. Endicott Interconnect Technologies aims to deliver innovative and reliable solutions that meet the ever-changing needs of their customers.
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