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Rabindra N Das

This inventor holds 32 USPTO granted patents and 4 published patent applications. Top assignees: Endicott Interconnect Technologies, Inc., I3 Electronics, Inc., Endicott International Technologies, Inc.. Active years: 2006-2017.

USPTO Granted Patents = 32 (Patent Applications = 4)

% Patents Active = 15.6

Average Co-Inventor Count = 3.7

ph-index = 9

Forward Citations = 173(Granted Patents)

Location History:

Ithaca, NY (US) (2007 - 2011)
Vestal, NY (US) (2006 - 2017)

Company Filing History:

27 out of 151

Endicott Interconnect Technologies, Inc.

Endicott International Technologies, Inc.

patents

Years Active: 2006-2017

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Areas of Expertise:

Circuitized Substrate

Electrically Conductive Adhesive

Multilayer Capacitors

Thermal Interposer

Embedded Capacitance

Solder Coated Microparticle Paste

Resistor Material

Capacitor Material

Liquid Crystal Polymer

Anti-Tamper Microchip Package

Coreless Layer Buildup Structure

Dielectric Interposer Assembly

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9756724 - Method of making a circuitized substrate (2017-09-05),

2. 9451693 - Electrically conductive adhesive (ECA) for multilayer device interconnects (2016-09-20),

3. 9420689 - Method of making a circuitized substrate (2016-08-16),

4. 9351408 - Coreless layer buildup structure with LGA and joining layer (2016-05-24),

5. 8685284 - Conducting paste for device level interconnects (2014-04-01),

6. 8607445 - Substrate having internal capacitor and method of making same (2013-12-17),

7. 8592299 - Solder and electrically conductive adhesive based interconnection for CZT crystal attach (2013-11-26),

8. 8558374 - Electronic package with thermal interposer and method of making same (2013-10-15),

9. 8541687 - Coreless layer buildup structure (2013-09-24),

10. 8536459 - Coreless layer buildup structure with LGA (2013-09-17),

11. 8501575 - Method of forming multilayer capacitors in a printed circuit substrate (2013-08-06),

12. 8499445 - Method of forming an electrically conductive printed line (2013-08-06),

13. 8446707 - Circuitized substrate with low loss capacitive material and method of making same (2013-05-21),

14. 8299371 - Circuitized substrate with dielectric interposer assembly and method (2012-10-30),

15. 8288857 - Anti-tamper microchip package based on thermal nanofluids or fluids (2012-10-16),

Title: Rabindra N Das: Pioneering Innovations in Circuit Technology

Introduction:

Rabindra N Das, a visionary inventor based in Vestal, NY, has left an indelible mark on the world of technology with his groundbreaking inventions. With a portfolio boasting 32 patents, Das is a trailblazer in the field of circuitized substrates and electrically conductive adhesives.

Latest Patents:

Das's latest patents showcase his ingenuity and forward-thinking approach to technology. One of his notable inventions is the "Method of making a circuitized substrate," which involves a conductive paste with nano-particles for creating seamless electrical connections. Additionally, his "Electrically conductive adhesive for multilayer device interconnects" revolutionizes Z-axis interconnects in multilayer devices by offering a versatile and efficient adhesive mixture.

Career Highlights:

Throughout his illustrious career, Das has made significant contributions to renowned companies such as Endicott Interconnect Technologies, Inc. and I3 Electronics, Inc. His expertise in circuit technology and adhesive materials has propelled him to the forefront of innovation in the industry.

Collaborations:

Das has collaborated with esteemed professionals in his field, including Voya Rista Markovich and John M Lauffer. Together, they have spearheaded projects that have reshaped the landscape of circuit technology and paved the way for future advancements in the field.

Conclusion:

In conclusion, Rabindra N Das stands as a true visionary in the world of inventions, with a remarkable track record of pioneering solutions that have made a significant impact on the technological landscape. His innovative spirit and dedication to pushing the boundaries of circuit technology make him a prominent figure in the realm of technological advancements.

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