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For the Inventor, By the Inventor

Vestal, NY, United States of America

Rabindra N Das

This inventor holds 32 USPTO granted patents and 4 published patent applications, primarily in Circuitized Substrates. Top assignees: Endicott Interconnect Technologies, Inc., I3 Electronics, Inc., Endicott International Technologies, Inc.. Active years: 2006-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rabindra N Das. Retrieved from https://idiyas.com/inventor/rabindra-n-das

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 32 

% Patents Active = 15.6

Average Co-Inventor Count = 3.7

ph-index = 9

Forward Citations = 173(Granted Patents)


Location History:

  • Ithaca, NY (US) (2007 - 2011)
  • Vestal, NY (US) (2006 - 2017)

Company Filing History:

goldMedal27 out of 151 
 
Endicott Interconnect Technologies, Inc.
 patents
silverMedal4 out of 4 
 
I3 Electronics, Inc.
 patents
bronzeMedal1 out of 2 
 
Endicott International Technologies, Inc.
 patents

Years Active: 2006-2017

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Areas of Expertise:
Circuitized Substrate
Multilayer Capacitors
Electrically Conductive Adhesive
Thermal Interposer
Coreless Layer Buildup
Internal Capacitor
Solder Connections
Dielectric Interposer
Resistor Material
Capacitive Substrate
Conductive Paste
Information Handling System
32 patents (USPTO):Explore Patents
1. 9756724 - Method of making a circuitized substrate (2017-09-05),
2. 9451693 - Electrically conductive adhesive (ECA) for multilayer device interconnects (2016-09-20),
3. 9420689 - Method of making a circuitized substrate (2016-08-16),
4. 9351408 - Coreless layer buildup structure with LGA and joining layer (2016-05-24),
5. 8685284 - Conducting paste for device level interconnects (2014-04-01),
6. 8607445 - Substrate having internal capacitor and method of making same (2013-12-17),
7. 8592299 - Solder and electrically conductive adhesive based interconnection for CZT crystal attach (2013-11-26),
8. 8558374 - Electronic package with thermal interposer and method of making same (2013-10-15),
9. 8541687 - Coreless layer buildup structure (2013-09-24),
10. 8536459 - Coreless layer buildup structure with LGA (2013-09-17),
11. 8501575 - Method of forming multilayer capacitors in a printed circuit substrate (2013-08-06),
12. 8499445 - Method of forming an electrically conductive printed line (2013-08-06),
13. 8446707 - Circuitized substrate with low loss capacitive material and method of making same (2013-05-21),
14. 8299371 - Circuitized substrate with dielectric interposer assembly and method (2012-10-30),
15. 8288857 - Anti-tamper microchip package based on thermal nanofluids or fluids (2012-10-16),

Title: Rabindra N Das: Pioneering Innovations in Circuit Technology

Introduction:

Rabindra N Das, a visionary inventor based in Vestal, NY, has left an indelible mark on the world of technology with his groundbreaking inventions. With a portfolio boasting 32 patents, Das is a trailblazer in the field of circuitized substrates and electrically conductive adhesives.

Latest Patents:

Das's latest patents showcase his ingenuity and forward-thinking approach to technology. One of his notable inventions is the "Method of making a circuitized substrate," which involves a conductive paste with nano-particles for creating seamless electrical connections. Additionally, his "Electrically conductive adhesive for multilayer device interconnects" revolutionizes Z-axis interconnects in multilayer devices by offering a versatile and efficient adhesive mixture.

Career Highlights:

Throughout his illustrious career, Das has made significant contributions to renowned companies such as Endicott Interconnect Technologies, Inc. and I3 Electronics, Inc. His expertise in circuit technology and adhesive materials has propelled him to the forefront of innovation in the industry.

Collaborations:

Das has collaborated with esteemed professionals in his field, including Voya Rista Markovich and John M Lauffer. Together, they have spearheaded projects that have reshaped the landscape of circuit technology and paved the way for future advancements in the field.

Conclusion:

In conclusion, Rabindra N Das stands as a true visionary in the world of inventions, with a remarkable track record of pioneering solutions that have made a significant impact on the technological landscape. His innovative spirit and dedication to pushing the boundaries of circuit technology make him a prominent figure in the realm of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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