The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Apr. 22, 2010
Voya Markovich, Endwell, NY (US);
Timothy Antesberger, Vestal, NY (US);
Frank D. Egitto, Binghamton, NY (US);
William Wilson, Waverly, NY (US);
Rabindra N. Das, Vestal, NY (US);
Voya Markovich, Endwell, NY (US);
Timothy Antesberger, Vestal, NY (US);
Frank D. Egitto, Binghamton, NY (US);
William Wilson, Waverly, NY (US);
Rabindra N. Das, Vestal, NY (US);
Abstract
A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile