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For the Inventor, By the Inventor

Binghamton, NY, United States of America

Frank Daniel Egitto

USPTO Granted Patents = 86 

Average Co-Inventor Count = 3.6

ph-index = 16

Forward Citations = 1,078(Granted Patents)


Inventors with similar research interests:


Location History:

  • Binghampton, NY (US) (2003)
  • Binghamton, NY (US) (1987 - 2016)

Company Filing History:

goldMedal58 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal26 out of 151 
 
Endicott Interconnect Technologies, Inc.
 patents
bronzeMedal1 out of 4 
 
I3 Electronics, Inc.
 patents
4. 1 out of 2 
 
Endicott International Technologies, Inc.
 patents

Years Active: 1987-2016

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86 patents (USPTO):
1. 9351408 - Coreless layer buildup structure with LGA and joining layer (2016-05-24),
2. 8607445 - Substrate having internal capacitor and method of making same (2013-12-17),
3. 8558374 - Electronic package with thermal interposer and method of making same (2013-10-15),
4. 8541687 - Coreless layer buildup structure (2013-09-24),
5. 8536459 - Coreless layer buildup structure with LGA (2013-09-17),
6. 8501575 - Method of forming multilayer capacitors in a printed circuit substrate (2013-08-06),
7. 8499445 - Method of forming an electrically conductive printed line (2013-08-06),
8. 8405229 - Electronic package including high density interposer and circuitized substrate assembly utilizing same (2013-03-26),
9. 8245392 - Method of making high density interposer and electronic package utilizing same (2012-08-21),
10. 8240031 - Method of joining a semiconductor device/chip to a printed wiring board (2012-08-14),
11. 8240027 - Method of making circuitized substrates having film resistors as part thereof (2012-08-14),
12. 8198739 - Semi-conductor chip with compressible contact structure and electronic package utilizing same (2012-06-12),
13. 7981245 - Multi-layered interconnect structure using liquid crystalline polymer dielectric (2011-07-19),
14. 7897877 - Capacitive substrate (2011-03-01),
15. 7875811 - High speed interposer (2011-01-25),

Title: The Innovative Mind of Frank Daniel Egitto

Introduction:

Frank Daniel Egitto, a prolific inventor hailing from Binghamton, NY, has made significant contributions to the field of electronic engineering with an impressive portfolio of 86 patents.

Latest Patents:

Among his latest patents is the "Coreless layer buildup structure with LGA and joining layer," revolutionizing the substrate used in PCB or PWB boards. Egitto's innovative approach involves coreless buildup dielectric layers comprising thermoset and thermoplastic resins, along with land grid array (LGA) packaging.

Another notable patent is the "Substrate having internal capacitor and method of making same," detailing a method to create circuitized substrates with integrated capacitors through the formation of capacitive dielectric material and conductive channels, enabling the development of multilayered PCBs or chip carriers.

Career Highlights:

Egitto's remarkable career includes stints at renowned companies such as IBM (International Business Machines Corporation) and Endicott Interconnect Technologies, Inc., where he honed his skills and brought his groundbreaking ideas to life.

Collaborations:

Throughout his journey, Egitto collaborated with talented individuals like Voya Rista Markovich and Luis Jesus Matienzo, shaping the landscape of electronic innovation with their combined expertise and passion for excellence.

Conclusion:

Frank Daniel Egitto's trailblazing work in electronic engineering stands as a testament to his ingenuity and dedication to pushing the boundaries of technological advancements. His legacy will continue to inspire future generations of inventors to pursue innovation that makes a lasting impact on the world.

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