For the Inventor, By the Inventor

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Endicott, NY, United States of America

Endicott International Technologies, Inc.

USPTO Granted Patents = 2

Forward Citations = 1

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9 inventors (with patents filed for the assignee):

Timothy Eugene Antesberger (1 out of 14 patents)

Rabindra N Das (1 out of 32 patents)

Rajinder S Rai (1 out of 8 patents)

4. Voya Rista Markovich (1 out of 252 patents)

5. Frank Daniel Egitto (1 out of 86 patents)

6. How Tzu Lin (1 out of 47 patents)

7. John Steven Kresge (1 out of 46 patents)

8. Ronald Verne Smith (1 out of 6 patents)

9. William E Wilson (1 out of 36 patents)

2 patents: Sort by Forward Citations

1. 8240031 - Method of joining a semiconductor device/chip to a printed wiring board (2012-08-14),

2. 6958106 - Material separation to form segmented product (2005-10-25),

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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#10 in Endicott, NY

#5,655 in New York

#92,696 in US

Endicott, NY, United States of America

Endicott International Technologies, Inc.

Forward Citations = 1

9 inventors:

Timothy Eugene Antesberger (1 out of 14 patents)

Rabindra N Das (1 out of 32 patents)

Rajinder S Rai (1 out of 8 patents)

4. Voya Rista Markovich (1 out of 252 patents)

5. Frank Daniel Egitto (1 out of 86 patents)

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