Company Filing History:

39 out of 164,108

International Business Machines Corporation

patents

6 out of 151

Endicott Interconnect Technologies, Inc.

patents

1 out of 2

Endicott International Technologies, Inc.

patents

Years Active: 1994-2012

where 'Filed Patents' based on already Granted Patents

46 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8240027 - Method of making circuitized substrates having film resistors as part thereof (2012-08-14),

2. 8198551 - Power core for use in circuitized substrate and method of making same (2012-06-12),

3. 7595454 - Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate (2009-09-29),

4. 7163847 - Method of making circuitized substrate (2007-01-16),

5. 7091066 - Method of making circuitized substrate (2006-08-15),

6. 7084014 - Method of making circuitized substrate (2006-08-01),

7. 7024764 - Method of making an electronic package (2006-04-11),

8. 6998290 - Economical high density chip carrier (2006-02-14),

9. 6958106 - Material separation to form segmented product (2005-10-25),

10. 6887779 - Integrated circuit structure (2005-05-03),

11. 6868604 - Method for forming an electrical structure (2005-03-22),

12. 6829823 - Method of making a multi-layered interconnect structure (2004-12-14),

13. 6753612 - Economical high density chip carrier (2004-06-22),

14. 6720502 - Integrated circuit structure (2004-04-13),

15. 6693031 - Formation of a metallic interlocking structure (2004-02-17),

Title: The Innovative Journey of John Steven Kresge

Introduction: John Steven Kresge, hailing from Binghamton, NY, has made significant contributions to the field of circuitized substrates. With a remarkable portfolio of 46 patents, Kresge has established himself as a pioneer in the development of technologies that enhance the performance and reliability of electronic components.

Latest Patents: Among his latest innovations are two noteworthy patents. The first is titled "Method of making circuitized substrates having film resistors as part thereof." This method focuses on forming individual film resistors on a circuitized substrate while ensuring their resistance values meet precise specifications through careful measurements and selective isolation of resistive materials. The second patent, "Power core for use in circuitized substrate and method of making same," details the design of a power core featuring layers of low expansion dielectric materials and conductive layers, aimed at preventing shorting issues in finely defined holes within the substrate. These patents exemplify Kresge's commitment to advancing electronic design and functionality.

Career Highlights: Kresge's professional journey includes impactful roles at notable companies. He has worked with International Business Machines Corporation (IBM) and Endicott Interconnect Technologies, Inc., where he contributed to groundbreaking projects that pushed the boundaries of electrical engineering and circuit design. His experience in these prestigious organizations has greatly influenced his innovative capabilities.

Collaborations: Throughout his career, Kresge has collaborated with talented professionals including James Robert Wilcox and David Noel Light. These partnerships have fostered a collaborative environment that nurtures creativity and ingenuity in the field of electronics, leading to the successful development of several patents and innovative solutions.

Conclusion: John Steven Kresge's dedication to innovation is evident in his extensive patent portfolio and influential career. His latest inventions continue to enhance the capabilities of circuitized substrates, solidifying his position as a leading inventor in the field. As technology advances, Kresge's contributions will undoubtedly play a significant role in shaping the future of electronic design.

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