The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Nov. 18, 2003
Sylvia Adae-amoakoh, Binghamton, NY (US);
John S. Kresge, Binghamton, NY (US);
Voya R. Markovich, Endwell, NY (US);
Thurston B. Youngs, Jr., Endicott, NY (US);
Sylvia Adae-Amoakoh, Binghamton, NY (US);
John S. Kresge, Binghamton, NY (US);
Voya R. Markovich, Endwell, NY (US);
Thurston B. Youngs, Jr., Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.