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For the Inventor, By the Inventor

Vestal, NY, United States of America

Thurston Bryce Youngs, Jr

USPTO Granted Patents = 16

Average Co-Inventor Count = 3.3

ph-index = 10

Forward Citations = 352(Granted Patents)


Location History:

  • Vestal, NY (US) (1994 - 2000)
  • Endicott, NY (US) (1999 - 2006)

Company Filing History:

goldMedal16 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1994-2006

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16 patents (USPTO):
1. 6998290 - Economical high density chip carrier (2006-02-14),
2. 6946329 - Methods of making and using a floating interposer (2005-09-20),
3. 6774315 - Floating interposer (2004-08-10),
4. 6753612 - Economical high density chip carrier (2004-06-22),
5. 6156165 - Method of forming a metallization feature on an edge of an IC chip (2000-12-05),
6. 6059939 - Method for high density edge mounting of chips (2000-05-09),
7. 5903437 - High density edge mounting of chips (1999-05-11),
8. 5889654 - Advanced chip packaging structure for memory card applications (1999-03-30),
9. 5875011 - Liquid crystal display tile interconnected to a tile carrier and method (1999-02-23),
10. 5818107 - Chip stacking by edge metallization (1998-10-06),
11. 5743004 - Method of forming electronic multilayer printed circuit boards or cards (1998-04-28),
12. 5713127 - Non-annular lands (1998-02-03),
13. 5539156 - Non-annular lands (1996-07-23),
14. 5473813 - Methods of forming electronic multi-layer printed circuit boards and/or (1995-12-12),
15. 5418690 - Multiple wiring and X section printed circuit board technique (1995-05-23),

Title: Innovator Spotlight: Thurston Bryce Youngs, Jr.

Introduction

Thurston Bryce Youngs, Jr., an accomplished inventor based in Vestal, NY, holds an impressive portfolio of 16 patents. His innovations primarily focus on advancements in semiconductor technology, showcasing his significant contributions to the field.

Latest Patents

Among his notable inventions is the "Economical High Density Chip Carrier," which presents a novel method for creating a flip-chip joinable substrate. This substrate features non-plated-on contact pads and consists of an external metal foil layer, a dielectric layer, and a patterned internal metal layer. With an innovative approach, the design incorporates a microvia cavity filled with conductive paste to enhance connectivity.

In addition, Youngs has developed methods for creating and utilizing a "Floating Interposer." This invention employs a flexible, compliant layer that connects a chip die directly to a circuit card without the need for encapsulation. It effectively addresses the stress relief issues caused by thermal mismatch between the chip die and the circuit card. Utilizing an array of copper-plated vias, this interposer provides both horizontal and vertical stress relief, allowing for reliable solder connections.

Career Highlights

Thurston currently works at International Business Machines Corporation (IBM), where he continues to innovate and push the boundaries of semiconductor design and manufacturing. His extensive experience and creativity have been vital in propelling numerous projects within the company.

Collaborations

Throughout his career, Youngs has collaborated with fellow inventors, notably Mark Vincent Pierson and Ivan I Chobot. These partnerships have fostered a rich exchange of ideas and further advanced their collective contributions to the technology sector.

Conclusion

Thurston Bryce Youngs, Jr.'s work exemplifies the spirit of innovation in semiconductor technology. His latest patents reflect a commitment to enhancing product performance and reliability, making substantial impacts on the industry. As he continues his work at IBM, his contributions will undoubtedly shape the future of technology.

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