The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2005
Filed:
Nov. 21, 2003
David J. Alcoe, Vestal, NY (US);
Francis J. Downes, Jr., Vestal, NY (US);
Gerald W. Jones, Apalachin, NY (US);
John S. Kresge, Binghamton, NY (US);
Cheryl L. Tytran-palomaki, Endicott, NY (US);
David J. Alcoe, Vestal, NY (US);
Francis J. Downes, Jr., Vestal, NY (US);
Gerald W. Jones, Apalachin, NY (US);
John S. Kresge, Binghamton, NY (US);
Cheryl L. Tytran-Palomaki, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor chip carrier having an increased chip connector and plated through hole density. In particular, a substrate having a plurality of plated through holes therein, and a fatigue resistant redistribution layer thereon. The redistribution layer includes a plurality of vias selectively positioned over and contacting the plated through holes. The substrate further including a ground plane, two pair of signal planes, and two pair of power planes, wherein the second pair of power planes are located directly underneath the external dielectric layer. A buried plated through hole within the substrate.