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For the Inventor, By the Inventor

Vestal, NY, United States of America

Timothy Eugene Antesberger

USPTO Granted Patents = 14 

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 19(Granted Patents)


Location History:

  • Binghamton, NY (US) (2005 - 2007)
  • Vestal, NY (US) (2012 - 2023)

Company Filing History:

goldMedal8 out of 151 
 
Endicott Interconnect Technologies, Inc.
 patents
silverMedal4 out of 7,268 
 
Corning Incorporated
 patents
bronzeMedal1 out of 2 
 
Endicott International Technologies, Inc.
 patents
4. 1 out of 4 
 
I3 Electronics, Inc.
 patents

Years Active: 2005-2025

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14 patents (USPTO):
1. 12377594 - System for manufacturing of honeycomb extrusion dies and manufacturing methods thereof (2025-08-05),
2. 12122066 - Extrusion dies and methods of manufacturing the same (2024-10-22),
3. 11833604 - Method of preparing an electrode for use in forming a honeycomb extrusion die (2023-12-05),
4. 10611051 - Systems and methods for skinning articles (2020-04-07),
5. 9351408 - Coreless layer buildup structure with LGA and joining layer (2016-05-24),
6. 8541687 - Coreless layer buildup structure (2013-09-24),
7. 8536459 - Coreless layer buildup structure with LGA (2013-09-17),
8. 8405229 - Electronic package including high density interposer and circuitized substrate assembly utilizing same (2013-03-26),
9. 8245392 - Method of making high density interposer and electronic package utilizing same (2012-08-21),
10. 8198551 - Power core for use in circuitized substrate and method of making same (2012-06-12),
11. 7163847 - Method of making circuitized substrate (2007-01-16),
12. 7091066 - Method of making circuitized substrate (2006-08-15),
13. 7084014 - Method of making circuitized substrate (2006-08-01),
14. 6958106 - Material separation to form segmented product (2005-10-25),

Certainly! Here is the article about inventor Timothy Eugene Antesberger:

Title: Timothy Eugene Antesberger: Pioneering Innovations in Technology

Introduction:

Timothy Eugene Antesberger, hailing from Vestal, NY (US), is a visionary inventor whose remarkable contributions have propelled technology into new realms of advancement. With a passion for innovation and a relentless pursuit of progress, he has established himself as a trailblazer in the field of technology.

Latest Patents:

Timothy has an impressive portfolio of 12 patents, showcasing his ingenuity and expertise in the industry. Among his latest patents is a groundbreaking "Method of preparing an electrode for use in forming a honeycomb extrusion die", revolutionizing the manufacturing process for electrodes. Additionally, his invention of "Systems and methods for skinning articles" demonstrates his creative approach to enhancing production methods.

Career Highlights:

Having worked at renowned companies such as Endicott Interconnect Technologies, Inc. and Corning Incorporated, Timothy has honed his skills and expertise in the technological domain. His innovative solutions and forward-thinking approaches have significantly impacted the way technology is developed and implemented in various industries.

Collaborations:

Throughout his career, Timothy has collaborated with esteemed professionals in the field, including Frank Daniel Egitto and Voya Rista Markovich. These collaborations have not only enriched his work but have also led to the creation of groundbreaking inventions that have left a lasting impact on the industry.

Conclusion:

In conclusion, Timothy Eugene Antesberger stands out as a beacon of innovation, with his inventive spirit and dedication to progress shaping the future of technology in remarkable ways. His exemplary work ethic, coupled with his visionary approach to problem-solving, cements his legacy as a pioneering inventor in the realm of technology.

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