Forward Citations = 2

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11 inventors (with patents filed for the assignee):

Rabindra N Das (4 out of 32 patents)

Voya Rista Markovich (3 out of 252 patents)

Timothy Eugene Antesberger (1 out of 14 patents)

4. Kostas I Papathomas (1 out of 59 patents)

5. John M Lauffer (1 out of 130 patents)

6. Konstantinos I Papathomas (1 out of 96 patents)

7. Benson Chan (1 out of 51 patents)

8. Michael J Rowlands (1 out of 15 patents)

9. Frank Daniel Egitto (1 out of 86 patents)

10. William E Wilson (1 out of 36 patents)

11. Roy H Magnuson (1 out of 35 patents)

4 patents: Sort by Forward Citations

1. 9756724 - Method of making a circuitized substrate (2017-09-05),

2. 9451693 - Electrically conductive adhesive (ECA) for multilayer device interconnects (2016-09-20),

3. 9420689 - Method of making a circuitized substrate (2016-08-16),

4. 9351408 - Coreless layer buildup structure with LGA and joining layer (2016-05-24),

I3 Electronics, Inc. is a leading provider of advanced electronic manufacturing services, specializing in high-mix, low-to-medium volume programs. With state-of-the-art facilities and a skilled workforce, we offer a range of services including PCB assembly, test engineering, box build assembly, and supply chain management. We are committed to delivering high-quality, cost-effective solutions to meet our customers' diverse needs.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

4 Patents

#7 in

#58,997 in

Endicott, NY, United States of America

I3 Electronics, Inc.