The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Aug. 05, 2011
Rabindra N. Das, Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
John M. Lauffer, Waverly, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
Benson Chan, Vestal, NY (US);
Rabindra N. Das, Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
John M. Lauffer, Waverly, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
Benson Chan, Vestal, NY (US);
Abstract
A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.