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Endicott, NY, United States of America

Konstantinos I Papathomas

USPTO Granted Patents = 96 (Patent Applications = 1)

Average Co-Inventor Count = 2.8

ph-index = 17

Forward Citations = 1,317(Granted Patents)

Forward Citations (Not Self Cited) = 1,290(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

93 out of 164,197

International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

Cornell Research Foundation Inc.

International Business Corporation

I3 Electronics, Inc.

where one patent can have more than one assignee

Years Active: 1992-2016

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Areas of Expertise:

Electrically Conductive Adhesives

Multilayer Device Interconnects

Electronic Package Encapsulant

Z-Axis Interconnection Assembly

Printed Wiring Board Structures

High Aspect Ratio Via Holes

Tamper-Responding Enclosures

Die Attachment Techniques

Resin Compositions

Circuit Board Fabrication

Cap Attach Surface Modification

Chip Carrier Technologies

96 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9451693 - Electrically conductive adhesive (ECA) for multilayer device interconnects (2016-09-20),

2. 8446707 - Circuitized substrate with low loss capacitive material and method of making same (2013-05-21),

3. 7560501 - Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic (2009-07-14),

4. 7467742 - Electrically conducting adhesives for via fill applications (2008-12-23),

5. 7402254 - Method and structure for producing Z-axis interconnection assembly of printed wiring board elements (2008-07-22),

6. 7384682 - Electronic package with epoxy or cyanate ester resin encapsulant (2008-06-10),

7. 7321005 - Encapsulant composition and electronic package utilizing same (2008-01-22),

8. 7192997 - Encapsulant composition and electronic package utilizing same (2007-03-20),

9. 7076869 - Solid via layer to layer interconnect (2006-07-18),

10. 7064013 - Cap attach surface modification for improved adhesion (2006-06-20),

11. 7014731 - Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same (2006-03-21),

12. 6996903 - Formation of multisegmented plated through holes (2006-02-14),

13. 6931726 - Method of making and interconnect structure (2005-08-23),

14. 6929900 - Tamper-responding encapsulated enclosure having flexible protective mesh structure (2005-08-16),

15. 6820332 - Laminate circuit structure and method of fabricating (2004-11-23),

Title: Konstantinos I Papathomas: Pioneering Inventor from Endicott, NY

Introduction: Konstantinos I Papathomas is a renowned inventor hailing from Endicott, NY, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: Konstantinos I Papathomas holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise and interests.

Career Highlights: Throughout his illustrious career, Konstantinos I Papathomas has worked with leading research institutions and companies, consistently pushing the boundaries of what is possible through his inventive spirit and dedication to progress.

Collaborations: Konstantinos I Papathomas has collaborated with top universities and multinational corporations, fostering a culture of innovation and knowledge-sharing that has led to significant advancements in the industry.

Conclusion: In conclusion, Konstantinos I Papathomas stands as a visionary inventor whose work continues to inspire and shape the future of technology and beyond.

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