Konstantinos I Papathomas

This inventor holds 96 USPTO granted patents and 1 published patent application, primarily in Electronic Packaging (CPC class B32B3-00). Top assignees: International Business Machines Corporation, Cornell University, Endicott Interconnect Technologies, Inc.. Active years: 1992-2016.

USPTO Granted Patents = 96 (Patent Applications = 1)

% Patents Active = 70.8

Average Co-Inventor Count = 2.8

ph-index = 17

Forward Citations = 1,320(Granted Patents)

Forward Citations (Not Self Cited) = 1,290(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

93 out of 166,325

International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

International Business Corporation

patents

where one patent can have more than one assignee

Years Active: 1992-2016

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Areas of Expertise:

Conductive Adhesives

Multilayer Interconnects

Encapsulant Composition

Printed Circuit Boards

Z-Axis Interconnections

Thermoset Dielectric Material

Via Fill Applications

Cap Attach Modification

Chip Carriers

High Speed Wiring

Injection Molded Encapsulation

Flexible Protective Mesh

96 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9451693 - Electrically conductive adhesive (ECA) for multilayer device interconnects (2016-09-20),

2. 8446707 - Circuitized substrate with low loss capacitive material and method of making same (2013-05-21),

3. 7560501 - Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic (2009-07-14),

4. 7467742 - Electrically conducting adhesives for via fill applications (2008-12-23),

5. 7402254 - Method and structure for producing Z-axis interconnection assembly of printed wiring board elements (2008-07-22),

6. 7384682 - Electronic package with epoxy or cyanate ester resin encapsulant (2008-06-10),

7. 7321005 - Encapsulant composition and electronic package utilizing same (2008-01-22),

8. 7192997 - Encapsulant composition and electronic package utilizing same (2007-03-20),

9. 7076869 - Solid via layer to layer interconnect (2006-07-18),

10. 7064013 - Cap attach surface modification for improved adhesion (2006-06-20),

11. 7014731 - Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same (2006-03-21),

12. 6996903 - Formation of multisegmented plated through holes (2006-02-14),

13. 6931726 - Method of making and interconnect structure (2005-08-23),

14. 6929900 - Tamper-responding encapsulated enclosure having flexible protective mesh structure (2005-08-16),

15. 6820332 - Laminate circuit structure and method of fabricating (2004-11-23),

Title: Konstantinos I Papathomas: Pioneering Inventor from Endicott, NY

Introduction: Konstantinos I Papathomas is a renowned inventor hailing from Endicott, NY, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: Konstantinos I Papathomas holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise and interests.

Career Highlights: Throughout his illustrious career, Konstantinos I Papathomas has worked with leading research institutions and companies, consistently pushing the boundaries of what is possible through his inventive spirit and dedication to progress.

Collaborations: Konstantinos I Papathomas has collaborated with top universities and multinational corporations, fostering a culture of innovation and knowledge-sharing that has led to significant advancements in the industry.

Conclusion: In conclusion, Konstantinos I Papathomas stands as a visionary inventor whose work continues to inspire and shape the future of technology and beyond.