The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Sep. 27, 2002
Brian E. Curcio, Binghamton, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
Brian E. Curcio, Binghamton, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.