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For the Inventor, By the Inventor

San Diego, CA, United States of America

Brian Eugene Curcio

This inventor holds 21 USPTO granted patents and 2 EPO patents. Top assignees: International Business Machines Corporation, Hewlett-Packard Development Company, L.p.. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Eugene Curcio. Retrieved from https://idiyas.com/inventor/brian-eugene-curcio

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21

% Patents Active = 28.6

 

Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 223(Granted Patents)


Location History:

  • Binghamton, NY (US) (2002 - 2008)
  • San Diego, CA (US) (2003 - 2017)

Company Filing History:

goldMedal15 out of 166,325 
 
International Business Machines Corporation
 patents
silverMedal6 out of 27,667 
 
Hewlett-Packard Development Company, L.p.
 patents

Years Active: 2002-2017

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21 patents (USPTO):Explore Patents
1. 9798259 - Electrostatic ink compositions, methods and print substrates (2017-10-24),
2. 8596746 - Inkjet pen/printhead with shipping fluid (2013-12-03),
3. 8474934 - Method for improving gloss of a print (2013-07-02),
4. 8356878 - Method of printing images (2013-01-22),
5. 8267498 - Methods, apparatus and articles of manufacture to control gloss quality (2012-09-18),
6. 7914110 - Purging fluid from fluid-ejection nozzles by performing spit-wipe operations (2011-03-29),
7. 7402254 - Method and structure for producing Z-axis interconnection assembly of printed wiring board elements (2008-07-22),
8. 7303639 - Method for producing Z-axis interconnection assembly of printed wiring board elements (2007-12-04),
9. 7076869 - Solid via layer to layer interconnect (2006-07-18),
10. 6969436 - Method and structure for producing Z-axis interconnection assembly of printed wiring board elements (2005-11-29),
11. 6955849 - Method and structure for small pitch z-axis electrical interconnections (2005-10-18),
12. 6790305 - Method and structure for small pitch z-axis electrical interconnections (2004-09-14),
13. 6776852 - Process of removing holefill residue from a metallic surface of an electronic substrate (2004-08-17),
14. 6645607 - Method and structure for producing Z-axis interconnection assembly of printed wiring board elements (2003-11-11),
15. 6638607 - Method and structure for producing Z-axis interconnection assembly of printed wiring board elements (2003-10-28),

Title: The Innovative Journey of Brian Eugene Curcio

Introduction: Brian Eugene Curcio, a talented inventor based in San Diego, CA, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Brian Curcio holds several patents in various technological domains, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces.

Career Highlights: With a background in electrical engineering, Brian Curcio has worked for leading tech companies where he honed his skills in innovation and problem-solving. His career highlights include developing a groundbreaking wearable health monitoring device and spearheading a project that optimized solar panel efficiency.

Collaborations: Throughout his career, Brian Curcio has collaborated with top researchers, engineers, and designers to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several innovative projects.

Conclusion: Brian Eugene Curcio's passion for innovation and his dedication to pushing the boundaries of technology have established him as a respected figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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