International Business Machines Corporation

Hewlett-packard Development Company, L.P.

Brian Eugene Curcio

Donald Seton Farquhar

Konstantinos I Papathomas

Mark David Poliks

Thomas R Miller

Lisa Jeanine Jimarez

Keith P Brodock

Voya Rista Markovich

Peter Alfred Gruber

Frank Daniel Egitto

Alexey S Kabalnov

Robert Maynard Japp

Douglas Oliver Powell

Dustin W Blair

Glenn Thomas Haddick

Frederic Maurer

Manh-Quan Tam Nguyen

Yaron Grinwald

Elizabeth F Foster

Amit Kumar Sarkhel

Christina Marie Boyko

Michael Wozniak

Kai-Kong Iu

Reut Avigdor

Jeffrey D Rutland

David S Vejtasa

Guang Jin Li

Joshua A Mann

Joseph J Sniezek

Ryan Vu

Thomas Jeffrey Winter

Jeffrey Anderson

Chorng Ing Sow

Cynthia Jarom

Guang-Jin Li

Chorng Sow

Described herein is an electrostatic ink composition comprising a liquid carrier; and chargeable particles comprising a co-polymer of an alkylene monomer and an acrylic acid monomer, and a pearlescent, non-metallic pigment, wherein the chargeable particles are dispersed in the liquid carrier. Also described herein are a method of electrophotographic printing and a print substrate.

Electrostatic ink compositions, methods and print substrates

An inkjet pen includes a printhead firing chamber, a nozzle plate having at least one nozzle in fluid communication with the firing chamber, and a layer of shipping fluid within the firing chamber and covering the nozzle plate and the at least one nozzle. The shipping fluid has a density that is different than that of the ink that will be ejected from the firing chamber to form an image on media.

Inkjet pen/printhead with shipping fluid

A method for improving gloss of a print includes configuring a printing system to deposit ink drops from a plurality of inks in an ink set onto a print surface. During the depositing, the printing system is further configured to control micro-coalescence of the ink drops. The micro-coalescence is controlled by i) depositing the ink drops onto the print surface according to a predefined order of color based upon solids content, ii) adjusting a number of printing passes, iii) adjusting a delay time between the printing passes, and/or iv) depositing different amounts of the ink drops onto the print surface during different printing passes.

Method for improving gloss of a print

A method of printing an image includes co-dispensing a compensation vehicle and an ink from an ink set to sites on a printing medium to form a printed image. A combined amount of the ink and the compensation vehicle dispensed to each site is at least substantially equal to a minimum site value that is predetermined for the ink set and the printing medium. The method further includes applying an amount of an overcoat liquid to the printed image to obtain a predetermined ratio of gloss to haze.

Method of printing images

Example methods, apparatus and articles of manufacture to control gloss quality in printed images are disclosed. A disclosed example apparatus includes a print engine to print a plurality of images for respective ones of a plurality of colors, each image representing a plurality of different print parameter combinations, a scan module to measure a first plurality of light reflectances for respective ones of the plurality of images and the print parameter combinations, and a calibrator to calibrate an operation of the print engine for respective ones of the plurality of colors based on the first plurality of measured light reflectances, the operations of the print engine including at least one of an order of ink application, a rate of ink application, a density of ink application, or an applied amount of gloss enhancer.

Methods, apparatus and articles of manufacture to control gloss quality

Fluid is purged from a plurality of fluid-ejection nozzles of a fluid-ejection mechanism. A first series of spit-wipe operations is performed. A second series of spit-wipe operations is then performed.

Purging fluid from fluid-ejection nozzles by performing spit-wipe operations

A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

Method for producing Z-axis interconnection assembly of printed wiring board elements

The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.

Solid via layer to layer interconnect

A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

Method and structure for small pitch z-axis electrical interconnections

A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.

Process of removing holefill residue from a metallic surface of an electronic substrate

Growing community of inventors

San Diego, CA, United States of America

Brian Eugene Curcio