The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
May. 13, 2003
Christina M. Boyko, Endicott, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
Christina M. Boyko, Endicott, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of making an interconnect structure having an increased chip connector pad and plated through hole density is provided. In particular, the method includes the steps of providing a substrate having at least one plated through hole therein, and positioning a first conductive layer and a second conductive layer over the at least one plated through hole on opposing surfaces of the substrate. The method includes positioning a layer of dielectric material thereon on the first conductive layer. The dielectric layer includes at least one aperture selectively positioned directly over the at least one plated through hole. The substrate further includes a metal layer, and at least a pair of conductive layers that can carry signals, and power.