The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Aug. 14, 2003
Donald S. Farquhar, Endicott, NY (US);
Robert M. Japp, Vestal, NY (US);
John M. Lauffer, Waverly, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
Donald S. Farquhar, Endicott, NY (US);
Robert M. Japp, Vestal, NY (US);
John M. Lauffer, Waverly, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.