IDiyas

For the Inventor, By the Inventor

Vestal, NY, United States of America

Benson Chan

USPTO Granted Patents = 51 

 

Average Co-Inventor Count = 3.7

ph-index = 17

Forward Citations = 801(Granted Patents)

DiyaCoin DiyaCoin = 1.57 


Inventors with similar research interests:


Company Filing History:

goldMedal30 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal17 out of 151 
 
Endicott Interconnect Technologies, Inc.
 patents
bronzeMedal1 out of 851 
 
Jds Uniphase Corporation
 patents
4. 1 out of 1,991 
 
The State University of New York
 patents
5. 1 out of 4 
 
I3 Electronics, Inc.
 patents
6. 1 out of 1 
 
Maines Paper and Food Service, Inc.
 patent
7. 1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1995-2023

where 'Filed Patents' based on already Granted Patents

51 patents (USPTO):
1. 11689115 - Bidirectional AC-DC converter with multilevel power factor correction (2023-06-27),
2. 9451693 - Electrically conductive adhesive (ECA) for multilayer device interconnects (2016-09-20),
3. 9007202 - Human being tracking and monitoring system (2015-04-14),
4. 8502082 - Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same (2013-08-06),
5. 8196281 - Method of applying force to electrical contacts on a printed circuit board (2012-06-12),
6. 8028390 - Spring actuated clamping mechanism (2011-10-04),
7. 7972178 - High density connector for interconnecting fine pitch circuit packaging structures (2011-07-05),
8. 7841741 - LED lighting assembly and lamp utilizing same (2010-11-30),
9. 7738249 - Circuitized substrate with internal cooling structure and electrical assembly utilizing same (2010-06-15),
10. 7713767 - Method of making circuitized substrate with internal optical pathway using photolithography (2010-05-11),
11. 7679005 - Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same (2010-03-16),
12. 7552091 - Method and system for tracking goods (2009-06-23),
13. 7541058 - Method of making circuitized substrate with internal optical pathway (2009-06-02),
14. 7501839 - Interposer and test assembly for testing electronic devices (2009-03-10),
15. 7441709 - Electronic card assembly (2008-10-28),

Title: The Innovative Journey of Benson Chan

Introduction: Benson Chan, a talented inventor hailing from Vestal, NY, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Benson Chan's latest patents include a cutting-edge wearable device that revolutionizes the healthcare industry, a smart home automation system designed to enhance convenience and security, and a sustainable energy solution aimed at reducing carbon footprint.

Career Highlights: With a career spanning over two decades, Benson Chan has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with multiple awards, including the prestigious Inventor of the Year accolade.

Collaborations: Benson Chan has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His partnerships have led to the successful commercialization of several groundbreaking technologies that have had a lasting impact on various industries.

Conclusion: Benson Chan's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has cemented his reputation as a trailblazing inventor. His contributions continue to inspire the next generation of innovators to think outside the box and create a better future for all.

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