International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

Other

The State University of New York

Jds Uniphase Corporation

I3 Electronics, Inc.

Maines Paper and Food Service, Inc.

Benson Chan

John Henry Sherman

Voya Rista Markovich

How Tzu Lin

William Louis Brodsky

John M Lauffer

Richard Ronald Hall

Michael A Gaynes

Paul Francis Fortier

Glen Walden Johnson

Roy H Magnuson

Francois Guindon

David L Thomas

Fletcher L Chapin

William E Buchler, Jr

Frank Daniel Egitto

Gerald Daniel Malagrino, Jr

James Robert Moon

Ladd William Freitag

Real Joseph Tetreault

Martial A Letourneau

Joseph Paul Kuczynski

Mark David Poliks

Glenn Edward Myrto

John R Mankus

Robert S Pokrzywa

Vincent M Fiacco

Gary T Galli

Matthew J Lauffer

William Maines

Brian Samuel Beaman

Konstantinos I Papathomas

Kishor V Desai

James A Busby

Anilkumar Chinuprasad Bhatt

Charles Hampton Perry

David James Alcoe

Mitchell S Cohen

Rabindra N Das

Subahu Dhirubhai Desai

David R Motschman

Christopher John Majka

Candido C Tiberia

Ronald Verne Smith

Pritam Das

Robert W Nesky

John E Kozol

Pratap Singh

Sunil Dube

Kalyan Yenduri

James Earl Olson

Hong H Chan

William Kimler

Jianzhuang Huang

Theodore W Blizinski

A multilevel stage of a bidirectional AC power converter, comprising: a set of switches in series, a set of capacitors in series, the set of capacitors being in parallel with the set of switches; a number of sets of diodes in series; a center tap along the set of switches in series; and a pair of taps, respectively after the first and before the last switch of the set of switches in series; wherein each node between respective capacitors is connected to a node between respective diodes. A converter first stage for a 3-level converter has 6 switches, two capacitors, and two diodes, with the junction between diodes connected to the junction between capacitors, and the diode legs between switches-and-. The center tap is between switches-, and the pair of taps between switches-and-

Bidirectional AC-DC converter with multilevel power factor correction

A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

Electrically conductive adhesive (ECA) for multilayer device interconnects

A human being tracking and monitoring system comprising parent and child units, each of which include a microcontroller, a transceiver, a crystal, a battery, a voltage regulator and a switch with all of these elements except the battery being strategically positioned on one side of a circuit board, manual activation of the two switches in a first predetermined manner establishing a communication link between the parent and child units wherein a plurality of random identification signals are generated, this communication link between said parent and child units being broken by activation of the switches in a second predetermined manner.

Human being tracking and monitoring system

A circuitized substrate in which three conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to two dielectric layers. Each of the foil surfaces which physically bond to a respective dielectric layer are smooth (e.g., preferably by chemical processing) and may include a thin, organic layer thereon. One of the conductive layers may function as a ground or voltage (power) plane while the other two may function as signal planes with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.

Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same

A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four recesses, formed therein. A threaded aperture is also formed in the backer plate. A compression plate is also provided. A second set of apertures is formed along the periphery of the compression plate. The lower surface of the compression plate has at least one compression plate recess, and at least one compression plate aperture. At least one compression spring is disposed between the backer plate and the compression plate. A screw tension release mechanism is screwed into the backer plate threaded aperture and inserted through the compression plate aperture. When the release mechanism is loosened, backer plate is forced downwardly, applying a uniform force to all electrical contacts on the printed circuit board or card to which the clamping mechanism is attached.

Method of applying force to electrical contacts on a printed circuit board

Spring actuated clamping mechanism

A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array, that, in cooperation with a mating socket, allows pluggable connection of a micro device such as a MEMS device connected to a first printed circuit substrate. An outer set of contacts on the interposer provides electrical interconnection between the first substrate and a second substrate located atop the high connection density micro device, thereby effectively sandwiching the micro device between the first and second substrates. The outer set of contacts may be disposed in a circular array.

High density connector for interconnecting fine pitch circuit packaging structures

An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such assemblies may be used within an LED lamp, as also provided herein. The lamp is ideal for use within medical and dental environments to assure optimal light onto a patient located at a specified distance from the lamp.

LED lighting assembly and lamp utilizing same

An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.

Method of making circuitized substrate with internal optical pathway using photolithography

A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.

Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same

A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.

Method and system for tracking goods

A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.

Method of making circuitized substrate with internal optical pathway

A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The apparatus includes a housing designed for being positioned on the PCB and have one of the substrates oriented therein during device engagement. The engaging contacts of the upper (second) substrate are sculpted to assure effective chip connection.

Interposer and test assembly for testing electronic devices

An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.

Electronic card assembly

Growing community of inventors

Vestal, NY, United States of America

Benson Chan