The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
May. 28, 2010
Benson Chan, Vestal, NY (US);
David J. Alcoe, Hayward, WI (US);
Benson Chan, Vestal, NY (US);
David J. Alcoe, Hayward, WI (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array, that, in cooperation with a mating socket, allows pluggable connection of a micro device such as a MEMS device connected to a first printed circuit substrate. An outer set of contacts on the interposer provides electrical interconnection between the first substrate and a second substrate located atop the high connection density micro device, thereby effectively sandwiching the micro device between the first and second substrates. The outer set of contacts may be disposed in a circular array.