The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Oct. 04, 2011
Applicants:

Rabindra N. Das, Vestal, NY (US);

Kostas I. Papathomas, Endicott, NY (US);

Voya R. Markovich, Endwell, NY (US);

Inventors:

Rabindra N. Das, Vestal, NY (US);

Kostas I. Papathomas, Endicott, NY (US);

Voya R. Markovich, Endwell, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); B23K 26/382 (2014.01); B23K 26/40 (2014.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0313 (2013.01); B23K 26/382 (2015.10); B23K 26/40 (2013.01); H01B 1/22 (2013.01); H05K 1/097 (2013.01); H05K 3/4053 (2013.01); H05K 3/462 (2013.01); H05K 3/4623 (2013.01); B23K 2201/40 (2013.01); B23K 2203/16 (2013.01); B23K 2203/172 (2015.10); B23K 2203/52 (2015.10); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15311 (2013.01); H05K 3/4069 (2013.01); H05K 3/4641 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/096 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/0425 (2013.01); H05K 2203/1152 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.


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