The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
May. 21, 2020
Corning Incorporated, Corning, NY (US);
Timothy Eugene Antesberger, Vestal, NY (US);
Dana Craig Bookbinder, Corning, NY (US);
Dana Eugene Coots, Tioga, PA (US);
Seyed Amir Farzadfar, Corning, NY (US);
Dominick John Forenz, Hammondsport, NY (US);
Ryan Joseph Grohsmeyer, Addison, NY (US);
Mark Lee Humphrey, Burdett, NY (US);
Zakariya Radwan Khayat, State College, PA (US);
Kenneth Richard Miller, Addison, NY (US);
Richard Curwood Peterson, Elmira Heights, NY (US);
John Charles Rector, Beaver Dams, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.