The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Dec. 20, 2010
Rabindra N. Das, Vestal, NY (US);
John M. Lauffer, Waverly, NY (US);
Voya R. Markovich, Endwell, NY (US);
James J. Mcnamara, Jr., Endwell, NY (US);
Rabindra N. Das, Vestal, NY (US);
John M. Lauffer, Waverly, NY (US);
Voya R. Markovich, Endwell, NY (US);
James J. McNamara, Jr., Endwell, NY (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.