Mark David Poliks

This inventor holds 50 USPTO granted patents and 2 published patent applications, primarily in Nanoparticle Sensors. Top assignees: International Business Machines Corporation, Endicott Interconnect Technologies, Inc., The State University of New York. Active years: 1993-2026.

USPTO Granted Patents = 50 (Patent Applications = 2)

% Patents Active = 66.0

Average Co-Inventor Count = 4.0

ph-index = 17

Forward Citations = 1,045(Granted Patents)

Company Filing History:

35 out of 166,264

International Business Machines Corporation

patents

9 out of 151

Endicott Interconnect Technologies, Inc.

patents

8 out of 2,043

The State University of New York

Memorial Sloan Kettering Cancer Center

patents

6. 2 out of 700

University of South Carolina

patents

where one patent can have more than one assignee

Years Active: 1993-2026

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Areas of Expertise:

Nanoparticle Sensor

Circuitized Substrate

Multilayered Interconnect

Thermal Nanofluids

Dielectric Layers

Printed Circuit Board

Flexible Protective Mesh

Electronic Package

High Aspect Ratio

Thermoset Dielectric

Porous Power Planes

Tamper-Responding Enclosure

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12605093 - Nanoparticle sensor having a nanofibrous membrane scaffold (2026-04-21),

2. 11331019 - Nanoparticle sensor having a nanofibrous membrane scaffold (2022-05-17),

3. 10064283 - Embedded thin films (2018-08-28),

4. 9835737 - Autonomous gamma, X-ray, and particle detector (2017-12-05),

5. 9606245 - Autonomous gamma, X-ray, and particle detector (2017-03-28),

6. 8882983 - Embedded thin films (2014-11-11),

7. 8685284 - Conducting paste for device level interconnects (2014-04-01),

8. 8288857 - Anti-tamper microchip package based on thermal nanofluids or fluids (2012-10-16),

9. 8211790 - Multilayered circuitized substrate with P-aramid dielectric layers and method of making same (2012-07-03),

10. 8084863 - Circuitized substrate with continuous thermoplastic support film dielectric layers (2011-12-27),

11. 7981245 - Multi-layered interconnect structure using liquid crystalline polymer dielectric (2011-07-19),

12. 7777136 - Multi-layered interconnect structure using liquid crystalline polymer dielectric (2010-08-17),

13. 7713767 - Method of making circuitized substrate with internal optical pathway using photolithography (2010-05-11),

14. 7646098 - Multilayered circuitized substrate with p-aramid dielectric layers and method of making same (2010-01-12),

15. 7541265 - Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate (2009-06-02),

Title: The Innovative Mind of Mark David Poliks

Introduction: Mark David Poliks is a renowned inventor hailing from Vestal, NY. His creative spirit and dedication to innovation have led to groundbreaking contributions in various fields.

Latest Patents: Mark David Poliks holds several patents in the areas of advanced materials, nanotechnology, and sustainable energy solutions. His recent patents focus on enhancing the efficiency of solar cells and developing eco-friendly packaging materials.

Career Highlights: With a background in materials science and engineering, Mark David Poliks has had a distinguished career in both academia and industry. He has served as a professor at leading universities, where he has mentored numerous aspiring inventors.

Collaborations: Throughout his career, Mark David Poliks has collaborated with top research institutions and companies to bring his inventions to life. His partnerships have resulted in the successful commercialization of several cutting-edge technologies.

Conclusion: Mark David Poliks continues to inspire the next generation of inventors with his passion for innovation and his commitment to creating a more sustainable future. His contributions to the field of materials science have left an indelible mark on the world of technology.