International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

The State University of New York

Cornell University

University of South Carolina

Memorial Sloan Kettering Cancer Center

Mark David Poliks

Robert Maynard Japp

Donald Seton Farquhar

Voya Rista Markovich

Konstantinos I Papathomas

Bernd Karl Appelt

William Thomas Fotorny

Kostantinos I Papathomas

Kostas I Papathomas

Roy H Magnuson

Brian Eugene Curcio

Frank Daniel Egitto

Douglas Oliver Powell

Rabindra N Das

Ross Downey Havens

John M Lauffer

Peter Alfred Gruber

Jane M Shaw

Claudius Feger

Benson Chan

How Tzu Lin

Michael O Thompson

Bahgat Ghaleb Sammakia

Jeffrey Alan Knight

Steve Harris Weingart

Frederic Maurer

Lawrence Robert Blumberg

Junghyun Cho

James N Turner

Andrzej Krol

Krishna Mandal

Biplab Kumar Roy

Steve Czarnecki

George Szeparowycz

C Ross Schmidtlein

Roy Rongqing Yu

Sung Kwon Kang

David W Wang

Benjamin S Hsiao

Chandrika Prasad

William T Chen

Chuan-Jian Zhong

Raymond Thomas Galasco

James J McNamara, Jr

Jin Luo

Frederick R Christie

Amarjit S Rai

Jan Obrzut

Anne Marie Quinn

Shan Yan

Shiyao Shan

Anne M Quinn, Deceased

Ning Kang

Jing Li

Nanoparticle-fibrous membrane composites are provided as tunable interfacial scaffolds for flexible chemical sensors and biosensors by assembling gold nanoparticles (Au NPs) in a fibrous membrane. The gold nanoparticles are functionalized with organic, polymeric and/or biological molecules. The fibrous membranes may include different filter papers, with one example featuring a multilayered fibrous membrane consisting of a cellulose nanofiber (CN) top layer, an electrospun polyacrylonitrile (PAN) nanofibrous midlayer (or alternate material), and a nonwoven polyethylene terephthalate (PET) fibrous support layer, with the nanoparticles provided on the fibrous membranes through interparticle molecular/polymeric linkages and nanoparticle-nanofibrous interactions. Molecular linkers may be employed to tune hydrogen bonding and electrostatic and/or hydrophobic/hydrophilic interactions to provide sensor specificity to gases or liquids. The sensors act as chemiresistor-type sensors. A preferred implementation is a sweat sensor.

Nanoparticle sensor having a nanofibrous membrane scaffold

A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.

Embedded thin films

A system and method for imaging gamma- and x-ray, and charged particles sources employing a three dimensional array of scintillation elements arranged surrounding an emission source. According to a preferred embodiment, each element of the array comprises a scintillator element, a solid-state photon detector, and processing electronics to output an electronic signal. The elements may be efficiently packed in both the X-Y plane and stacked in the Z-axis, to provide depth of interaction information. The elements of the array are preferably hierarchically arranged with control electronics provided together for subarray modules (e.g., an n&#xd7;m&#xd7;1 module), and synchronization electronics provided at a larger scale. The modules preferably communicate with a control system through a shared addressable packet switched digital communication network with a control and imaging system, and receive control information from that system through the network.

Autonomous gamma, X-ray, and particle detector

A conducting paste and method of forming the paste for device level interconnection. The conducting paste contains metal loading in the range 80-95% that is useful for making five micron device level interconnects. The conducting paste is made by mixing two different conducting pastes, each paste maintaining its micro level individual rich region in the mixed paste even after final curing. One paste contains at least one low melting point alloy and the other paste contains noble metal fillers such as gold or silver flakes. In general, average flake size below five micron is suitable for five micron interconnects. However, 1 micron or smaller silver flakes and an LMP mixture is preferred for five micron interconnects. The amount of LMP based paste in the final mixture is preferably 20-50% by weight. The nano micro paste embodiment shows good electrical yield (81%) and low contact resistance.

Conducting paste for device level interconnects

A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.

Anti-tamper microchip package based on thermal nanofluids or fluids

A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.

Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.

Circuitized substrate with continuous thermoplastic support film dielectric layers

A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

Multi-layered interconnect structure using liquid crystalline polymer dielectric

A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.

Method of making circuitized substrate with internal optical pathway using photolithography

Multilayered circuitized substrate with p-aramid dielectric layers and method of making same

A material for use as part of an internal capacitor within a circuitized substrate includes a polymer (e.g., a cycloaliphatic epoxy or phenoxy based) resin and a quantity of nano-powders of ferroelectric ceramic material (e.g., barium titanate) having a particle size substantially in the range of from about 0.01 microns to about 0.90 microns and a surface area for selected ones of said particles within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.

Method of making circuitized substrate with internal optical pathway

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Vestal, NY, United States of America

Mark David Poliks