The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Mar. 02, 2009
Applicants:
Robert M. Japp, Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
Kostas I. Papthomas, Endicott, NY (US);
Inventors:
Robert M. Japp, Vestal, NY (US);
Voya R. Markovich, Endwell, NY (US);
Kostas I. Papthomas, Endicott, NY (US);
Assignee:
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of making a circuitized substrate including a composite layer having a first dielectric sub-layer including a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein.
Japp, Robert. (2013). Method of making halogen-free circuitized substrate with reduced thermal expansion (U.S. Patent No. 8499440). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8499440
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile