James W Fuller, Jr

This inventor holds 16 USPTO granted patents and 1 published patent application. Top assignees: Endicott Interconnect Technologies, Inc., International Business Machines Corporation. Active years: 1998-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James W Fuller, Jr. Retrieved from https://idiyas.com/inventor/james-w-fuller-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 (Patent Applications = 1)

% Patents Active = 68.8

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 208(Granted Patents)

Company Filing History:

9 out of 151

Endicott Interconnect Technologies, Inc.

patents

7 out of 166,351

International Business Machines Corporation

patents

Years Active: 1998-2008

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7343674 - Method of making circuitized substrate assembly (2008-03-18),

2. 7163847 - Method of making circuitized substrate (2007-01-16),

3. 7091066 - Method of making circuitized substrate (2006-08-15),

4. 7084014 - Method of making circuitized substrate (2006-08-01),

5. 7071423 - Circuitized substrate assembly and method of making same (2006-07-04),

6. 7047630 - Method of making circuitized substrate assembly (2006-05-23),

7. 6900392 - Information handling system utilizing circuitized substrate (2005-05-31),

8. 6872894 - Information handling system utilizing circuitized substrate (2005-03-29),

9. 6832436 - Method for forming a substructure of a multilayered laminate (2004-12-21),

10. 6809269 - Circuitized substrate assembly and method of making same (2004-10-26),

11. 6781064 - Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same (2004-08-24),

12. 6529379 - Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method (2003-03-04),

13. 6407341 - Conductive substructures of a multilayered laminate (2002-06-18),

14. 5981880 - Electronic device packages having glass free non conductive layers (1999-11-09),

15. 5869356 - Method and structure for constraining the flow of incapsulant applied to (1999-02-09),

Title: The Legacy of James W Fuller, Jr: Pioneering Inventor from Endicott, NY

Introduction: James W Fuller, Jr is a distinguished inventor hailing from the vibrant town of Endicott, NY. His innovative spirit and dedication to pushing the boundaries of technology have solidified his reputation as a trailblazer in the field of inventions.

Latest Patents: James W Fuller, Jr holds several groundbreaking patents in various industries, showcasing his versatility and ingenuity as an inventor. His recent patents have revolutionized the way we interact with technology, setting new standards for innovation.

Career Highlights: Throughout his illustrious career, James W Fuller, Jr has consistently delivered cutting-edge solutions to complex problems. His ability to think outside the box and his relentless pursuit of excellence have led to numerous successful inventions that have made a significant impact on society.

Collaborations: James W Fuller, Jr has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into tangible products that have enhanced the lives of many.

Conclusion: James W Fuller, Jr's passion for innovation and his unwavering commitment to excellence continue to inspire the next generation of inventors. His legacy as a pioneering inventor from Endicott, NY, will undoubtedly endure for years to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: