The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Apr. 27, 2021
Nxp Usa, Inc., Austin, TX (US);
Scott M. Hayes, Chandler, AZ (US);
Michael B. Vincent, Chandler, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Rushik P. Tank, Chandler, AZ (US);
Kabir Mirpuri, Scottsdale, AZ (US);
Betty Hill-Shan Yeung, Chandler, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
A semiconductor device package having a thermal dissipation feature is provided. The semiconductor device package includes a package substrate. A semiconductor die is mounted on a first surface of the package substrate. A thermal conductive structure including a die pad portion is affixed to the semiconductor die. A limb portion of the thermal conductive structure extends laterally away from the die pad portion and overlaps a portion of the package substrate. A thermal conduction path is formed between the semiconductor die and a distal end of the limb portion.