For the Inventor, By the Inventor

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Austin, TX, United States of America

Nxp USA, Inc.

USPTO Granted Patents = 2,841

% Expired Patents = 10.6

EPO Patents = 857

Trademarks = 15

Forward Citations = 5,335

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2,311 inventors (with patents filed for the assignee):

Hongyuan Zhang (190 out of 929 patents)

Liwen Chu (147 out of 456 patents)

Hui-Ling Lou (83 out of 670 patents)

4. Sudhir Srinivasa (68 out of 228 patents)

5. Michael B Vincent (66 out of 89 patents)

6. Lakshminarayan Viswanathan (65 out of 92 patents)

7. Rui Cao (59 out of 160 patents)

8. Anirban Roy (47 out of 72 patents)

9. Scott M Hayes (47 out of 77 patents)

10. Jeffrey Kevin Jones (47 out of 68 patents)

11. Young Hoon Kwon (42 out of 204 patents)

12. Michael Andreas Staudenmaier (42 out of 57 patents)

13. Zhiwei Gong (36 out of 59 patents)

14. Jinjing Jiang (35 out of 177 patents)

15. Yakun Sun (33 out of 290 patents)

Core Competencies:

Multimodal Transistors

Diffusion Barrier Layer

Through Package Via

Power Amplifier Module

3D Integration

Wireless Network

Low Power Listening Mode

Memory Controller

Dynamic Random Access Memory

Molded Packages

Signal Transmission

2,841 patents: Sort by Forward Citations

1. 12740428 - Pitch-reducing solder interconnect for RF transitions (2026-09-15),

2. 12740418 - Semiconductor device packaging warpage control (2026-09-15),

3. 12739913 - Handshake for smooth roaming (2026-09-15),

4. 12739156 - Transceiver circuit (2026-09-15),

5. 12738906 - Power amplifier device having dies with elongated bondpads connected through a device substrate (2026-09-15),

6. 12738843 - Self-calibrating slope compensation in multi-phase DC-DC converters (2026-09-15),

7. 12738634 - Package on package semiconductor device with integrated antenna and method therefor (2026-09-15),

8. 12733537 - Two-part molding of device packages with spacers (2026-09-08),

9. 12733037 - Device, system, and method for coordinating restricted target wake time service periods of a plurality of access points (2026-09-08),

10. 12732888 - Wireless communications through wireless relay device (2026-09-08),

11. 12732204 - Motor voltage reconstruction by ADC oversampling and averaging (2026-09-08),

12. 12730491 - Transitions between low power modes in a processing system (2026-09-08),

13. 12727487 - Package with solder mask (2026-09-01),

14. 12720668 - Power amplifier modules and systems containing electromagnetic bandgap isolation arrays (2026-08-25),

15. 12719602 - Frame forwarding for range extension in a wireless network (2026-08-25),

NXP USA, Inc. is a global semiconductor manufacturer that provides high-performance mixed-signal and standard product solutions. With over 60 years of experience, NXP USA offers a wide range of integrated circuits and system solutions to enable secure connections for a smarter world. Their products are used in a variety of applications, including automotive, industrial, networking, consumer electronics, and more. NXP USA is committed to driving innovation and delivering solutions that enhance the lives of people around the globe.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

2,841 Patents

#3 in Austin, TX

#16 in Texas

#167 in US

#336 in the World

Austin, TX, United States of America

Nxp USA, Inc.

Forward Citations = 5,335

2,311 inventors:

Hongyuan Zhang (190 out of 929 patents)

Liwen Chu (147 out of 456 patents)

Hui-Ling Lou (83 out of 670 patents)

4. Sudhir Srinivasa (68 out of 228 patents)

5. Michael B Vincent (66 out of 89 patents)

Please report any incorrect information to [email protected]

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