Lakshminarayan Viswanathan

This inventor holds 92 USPTO granted patents and 6 published patent applications and 1 EPO patent, primarily in Microelectronic Packaging (CPC class H01L24-32). Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc., Motorola Corporation. Active years: 2000-2026.

USPTO Granted Patents = 92 (Patent Applications = 6)

% Patents Active = 93.5

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 3.1

ph-index = 10

Forward Citations = 390(Granted Patents)

Forward Citations (Not Self Cited) = 272(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Austin, TX (US) (2017)
Phoeniz, AZ (US) (2020)
Phoenix, AZ (US) (2000 - 2024)
Chandler, AZ (US) (2018 - 2024)

Company Filing History:

Freescale Semiconductor,inc.

Years Active: 2000-2026

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Areas of Expertise:

Molded Packages

Power Amplifier Modules

Thermal Interface Structures

Hybrid Device Assemblies

Microelectronic Components

Sinter-Bonded Structures

Radio Frequency Packages

Leadless Power Amplifier Packages

Thermal Vias

Electromagnetic Shielding

Substrate Fabrication

Heat Dissipation

92 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12557221 - Molded packages with through-mold interconnects (2026-02-17),

2. 12506446 - Power amplifier modules including topside cooling interfaces and methods for the fabrication thereof (2025-12-23),

3. 12506084 - Methods of fabricating substrates with thermal vias and sinter-bonded thermal dissipation structures (2025-12-23),

4. 12482719 - Low-stress thermal interface (2025-11-25),

5. 12470183 - Power amplifier modules, systems, and substrates containing field trapper structures (2025-11-11),

6. 12184237 - Surface-mount amplifier devices (2024-12-31),

7. 12094801 - Thick-silver layer interface (2024-09-17),

8. 12040291 - Radio frequency packages containing multilevel power substrates and associated fabrication methods (2024-07-16),

9. 12015004 - Hybrid device assemblies and method of fabrication (2024-06-18),

10. 12014971 - Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof (2024-06-18),

11. 11990872 - Power amplifier modules including topside cooling interfaces and methods for the fabrication thereof (2024-05-21),

12. 11984429 - Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof (2024-05-14),

13. 11929310 - Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods (2024-03-12),

14. 11830842 - Hybrid device assemblies and method of fabrication (2023-11-28),

15. 11749639 - Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods (2023-09-05),

Title: The Inventor Extraordinaire: Lakshminarayan Viswanathan

Introduction:

Meet Lakshminarayan Viswanathan, a prolific inventor based in Phoenix, AZ, with an impressive portfolio of 85 patents. His innovative spirit and commitment to technological advancements have made him a standout figure in the world of inventions.

Latest Patents:

Among his latest patents is a groundbreaking invention involving radio frequency packages containing multilevel power substrates and associated fabrication methods. This invention showcases his expertise in producing intricate technological solutions that push the boundaries of what is possible in the field of radio frequency technology. Additionally, his hybrid device assemblies and method of fabrication patent demonstrates his versatile skill set in developing cutting-edge electronics.

Career Highlights:

Lakshminarayan Viswanathan has made significant contributions to companies such as NXP USA, Inc. and Freescale Semiconductor, Inc., where his innovative ideas have been instrumental in driving technological advancements. His knack for problem-solving and creative thinking has led to the successful development of numerous pioneering technologies.

Collaborations:

Throughout his career, Lakshminarayan Viswanathan has worked alongside talented individuals such as Jaynal Abedin Molla and Fernando A Santos. These collaborations have not only fueled innovation but have also fostered a dynamic environment where ideas flourish and inventions thrive.

Conclusion:

In conclusion, Lakshminarayan Viswanathan stands as a testament to the power of innovation and dedication in the realm of technological advancements. His relentless pursuit of excellence and passion for invention continue to shape the future of the industry, inspiring others to reach for new heights in the world of patents and innovations.