The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Nov. 22, 2023
Nxp Usa, Inc., Austin, TX (US);
Zhiwei Gong, Chandler, AZ (US);
Lakshminarayan Viswanathan, Chandler, AZ (US);
Li Li, Scottsdale, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
Molded device packages which allow electrical contacts to coupled to a first surface of a circuit substrate such as a printed circuit board while allowing the opposite surface to remain exposed for other purposes such as bonding thermal structures such as heatsinks include electrically-conductive pillars which are bonded to the first surface of the substrate and encapsulated in molding material. The molding material can one or more cavities over disposed over the first surface of the substrate which can be evacuated or gas-filled. The electrically-conductive pillars protrude from connected manifold and are joined to each other by a frame portion of the manifold. The manifold is patterned with a masking material that protects the pillars from being etched during a selective etching process which removes the frame portion of the manifold to separate the electrically-conductive pillars from each other.