Scottsdale, AZ, United States of America

Li Li

This inventor holds 40 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Nxp USA, Inc., Motorola Corporation. Active years: 2001-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li Li. Retrieved from https://idiyas.com/inventor/li-li-auxep5x3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 40 

% Patents Active = 77.5

 

Average Co-Inventor Count = 3.7

ph-index = 9

Forward Citations = 262(Granted Patents)


Location History:

  • Endicott, NY (US) (2001 - 2003)
  • Gilbert, AZ (US) (2001 - 2005)
  • Plano, TX (US) (2003 - 2014)
  • Austin, TX (US) (2006 - 2017)
  • Cary, NC (US) (2020)
  • Cedar Park, TX (US) (2014 - 2022)
  • Scottsdale, AZ (US) (2006 - 2024)

Company Filing History:


Years Active: 2001-2026

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Areas of Expertise:
Semiconductor Packaging
Holographic Projections
Data Security
RF Devices
Cloud Outage Recovery
Power Substrates
Thermal Dissipation
Hybrid Device Assemblies
Interconnects
Printed Circuit
Resource Group Management
Conductive Paste
40 patents (USPTO):Explore Patents

Title: Innovations and Patents of Li Li

Introduction

Li Li, located in Scottsdale, AZ, is an accomplished inventor with a remarkable portfolio of 36 patents. His work primarily focuses on advancements in radio frequency technology and semiconductor fabrication methods, demonstrating his expertise in the field of electronics and materials engineering.

Latest Patents

Among his latest innovations, Li Li has contributed significantly to the development of radio frequency (RF) packages containing multilevel power substrates. One of his notable patents describes a method to produce a multilevel substrate panel, which includes obtaining a base panel with exposed metallic surfaces of prefabricated base structures. The innovation also encompasses the formation of a secondary panel level that incorporates patterned metal features embedded in a dielectric body, ensuring electrical contact through a direct plated interface.

Another significant patent detail is his work on hybrid device assemblies, which includes a functional substrate hosting electronic components and a cavity designed for semiconductor dies. This cavity extends from one surface of the substrate to another, providing a unique configuration that allows for the integration of components fabricated using differing technologies.

Career Highlights

Li Li’s career spans years of impactful work in leading technology companies. He has held positions at renowned organizations such as IBM and NXP USA, Inc., where he has leveraged his skills to create cutting-edge technological solutions. His contributions have positioned him as a thought leader in the realms of RF technology and semiconductor design.

Collaborations

Throughout his career, Li has collaborated with distinguished professionals, including Lakshminarayan Viswanathan and Su Liu. These collaborations have enhanced his projects, combining diverse expertise to innovate and push the boundaries of technology.

Conclusion

Li Li continues to be an influential figure in the innovation landscape, with his significant contributions to patents and advancements in electronic technologies. His work not only exemplifies his commitment to progress but also serves as an essential foundation for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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