International Business Machines Corporation

Nxp Usa, Inc.

Motorola Corporation

Freescale Semiconductor,inc.

Texas Instruments Corporation

Li Li

Lakshminarayan Viswanathan

Su Liu

Fernando A Santos

Sanjeev Balwant Sathe

Al Chakra

Jeremy A Greenberger

Jeffrey Kevin Jones

Andrew Dunshea

Hari Haranath Madduri

Jos Manuel Accapadi

Miguel Angel Jimarez

Jaynal Abedin Molla

David Alan Hepkin

Mysore Sathyanarayana Srinivas

Lisa Jeanine Jimarez

Audel Sanchez

Mahesh K Shah

Ryan D McNair

Hussain Hasanali Ladhani

Treliant Fang

Grover Herbert Neuman

Itzhack Goldberg

Shunguo Yan

Lianjun Liu

Eric A Johnson

Bruce John Chamberlin

Zhiwei Gong

David James Alcoe

Burton Jesse Carpenter

Lan Chu Tan

Riaz Yousuf Hussain

Shun-Meen Kuo

Zhichao Li

William Infantolino

Jerry Lynn White

Donald I Mead

Thomas M Culnane

Lih-Tyng Hwang

Steven G Rosser

Ben Gibbs

Alexandre A Da Silva

Allison M Moore

David N Cokely

Dionysius D Bell

Aruna Yedavilli

Boon Yew Low

Philip H Bowles

Robert B Lempkowski

Baoson Nguyen

Etai Lev Ran

James R Stack

Jong-Kai Lin

Lu Li

Mark Budman

Tien-Yu Tom Lee

Guoyou Chen

Shun Meen Kuo

Yifan Guo

Rex M Teggatz

Jan Obrzut

Scott E Lindsey

Luis Alberto Huertas-Sanchez

Fui Yee Lim

James Vernon Hause

Azubuike Victor Onwuta

Chunsheng Zhang

Miquel A Jimarez

Hassan Pooya Forghani-zadeh

Xinhua Wu

Barnabas Kadlecsik

Radio frequency (RF) packages containing multilevel power substrates and associated fabrication methods are disclosed. In an embodiment, the method includes producing a multilevel substrate panel by obtaining a base panel level containing prefabricated base structures and having a surface through which metallic surfaces of the prefabricated base structures are exposed. A secondary panel level is formed on the base layer to include patterned metal features embedded in a secondary dielectric body and electrically contacting the exposed metallic surfaces of the prefabricated base structures at a direct plated interface. The presingulated array of multilevel power substrates is separated into singulated multilevel power substrates each including a base substrate level formed from a singulated piece of the base panel level and a secondary substrate level formed from a singulated piece of the secondary substrate level.

Radio frequency packages containing multilevel power substrates and associated fabrication methods

A device assembly includes a functional substrate having one or more electronic components formed there. The functional substrate has a cavity extending from a first surface toward a second surface of the functional substrate at a location that lacks the electronic components. The device assembly further includes a semiconductor die placed within the cavity with a pad surface of the semiconductor die being opposite to a bottom of the cavity. The functional substrate may be formed utilizing a first fabrication technology and the semiconductor die may be formed utilizing a second fabrication technology that differs from the first fabrication technology.

Hybrid device assemblies and method of fabrication

A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.

Circuit modules with front-side interposer terminals and through-module thermal dissipation structures

A data security method may include storing user data to a first device and storing metadata corresponding to the user data to a second device. The method may further include making a first determination that at least one device selected from the group of the first device and the second device is not in communication with a third device. The method may further include disabling utilization of the user data in response to the first determination.

Data security through physical separation of data

A method, computer program product, and system for providing cross-lingual search results that retain cultural context include a processor(s) monitoring (with user permission) computing activities performed by the user, via a client. The processor(s) analyzes the computing activities to identify data comprising elements relevant to the user and relationships between the elements and the user. The processor(s) generates a data structure comprising the data. The processor(s) generates a search interface for obtaining entries in a first language to perform a query; the entries are search parameters embedded with a portion of the elements. The processor(s) obtains an entry in the first language. The processor(s) extracts the portion of the elements from the entry (cultural context for the entry). The processor(s) determines target languages for data responsive to the query. The processor(s) translates the search parameters and the cultural context into the target languages and executes searches on databases.

Context-sensitive cross-lingual searches

An approach is provided in which a system includes a GPU cluster. The GPU cluster includes multiple GPU nodes, that each includes a GPU core and a corresponding local cache. The GPU cluster also includes a shared memory and an internal bus that maintains cache coherency between the shared memory and the local caches included in the GPU nodes.

Cache coherency adopted GPU shared memory

A method of manufacturing a packaged semiconductor device includes forming an assembly by placing a semiconductor die over a substrate with a die attach material between the semiconductor die and the substrate. A conformal structure which includes a pressure transmissive material contacts at least a portion of a top surface of the semiconductor die. A pressure is applied to the conformal structure and in turn, the pressure is transmitted to the top surface of the semiconductor die by the pressure transmissive material. While the pressure is applied, concurrently encapsulating the assembly with a molding compound and exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter.

Semiconductor device package and methods of manufacture thereof

Embodiments include techniques for channeling elements in an analytics engine environment, techniques include analyzing a current process, and identifying critical data element types associated with the current process. The techniques also include receiving a real-time data stream including a plurality of data elements, and pre-filtering the plurality of data elements, wherein the pre-filtering determines one or more of the plurality of data elements are associated with the critical data element type. The technique includes selecting a channel of a plurality of channels to fast-path the one or more of the plurality of data elements based at least in part on the pre-filtering, and increasing a confidence level corresponding to the current process and the critical data element type based on a state of the current process.

Channeling elements in an analytics engine environment

A method for automatically prioritizing startup of resource groups during a migration event. The method may include monitoring resource usage of a first and a second set of applications associated, respectively, with a first and a second resource group executing on a first computing node. The method may additionally include generating respective first and second resource usage models for the first and second resource groups based on resource usage. The method may then include extrapolating, based on the first and second resource usage models, respective first and second resource group usage scores for the first and second resource groups at a second time in response to a migration event, the second time occurring subsequent to the first time. The method may further include determining, based on the extrapolating, a priority order for serially starting the first and second set of applications on a second computing node at the second time.

Automatic serial order starting of resource groups on failover systems based on resource group usage prediction

An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

Automatic serial starting of resource groups on failover based on the prediction of aggregate resource usage

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Scottsdale, AZ, United States of America

Li Li