The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Jul. 26, 2023
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Li Li, Scottsdale, AZ (US);

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Jeffrey Kevin Jones, Chandler, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/20 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/78 (2013.01); H01L 23/367 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/02 (2013.01); H01L 24/19 (2013.01); H01L 2224/214 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A device assembly includes a functional substrate having one or more electronic components formed there. The functional substrate has a cavity extending from a first surface toward a second surface of the functional substrate at a location that lacks the electronic components. The device assembly further includes a semiconductor die placed within the cavity with a pad surface of the semiconductor die being opposite to a bottom of the cavity. The functional substrate may be formed utilizing a first fabrication technology and the semiconductor die may be formed utilizing a second fabrication technology that differs from the first fabrication technology.


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