Zhiwei Gong

USPTO Granted Patents = 53 (Patent Applications = 18)

Average Co-Inventor Count = 3.5

ph-index = 9

Forward Citations = 233(Granted Patents)

Forward Citations (Not Self Cited) = 222(Dec 10, 2025)

Location History:

Tianjin, CN (2015)
Tempe, AZ (US) (2018)
Austin, TX (US) (2018 - 2020)
Chandler, AZ (US) (2012 - 2024)

Company Filing History:

Freescale Semiconductor,inc.

4. 1 out of 832,843

Other

patents

Years Active: 2012-2025

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Areas of Expertise:

Semiconductor Packaging

Thermal Dissipation

Microelectronic Devices

EMI/RFI Shielding

Three-Dimensional Integrated Circuits

Fan-Out Wafer Level Packages

Multi-Die Packaging

Additive Manufacturing

Radio Frequency Packages

Surface-Mount Amplifiers

Cavity Carrier Technology

Embedded Electronic Devices

53 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12406896 - Semiconductor device package having thermal dissipation feature and method therefor (2025-09-02),

2. 12387985 - Semiconductor device with cavity carrier and method therefor (2025-08-12),

3. 12184237 - Surface-mount amplifier devices (2024-12-31),

4. 12125716 - Semiconductor device packaging warpage control (2024-10-22),

5. 12040291 - Radio frequency packages containing multilevel power substrates and associated fabrication methods (2024-07-16),

6. 11967507 - Tie bar removal for semiconductor device packaging (2024-04-23),

7. 11935809 - Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements (2024-03-19),

8. 11817366 - Semiconductor device package having thermal dissipation feature and method therefor (2023-11-14),

9. 11791283 - Semiconductor device packaging warpage control (2023-10-17),

10. 11728285 - Semiconductor device packaging warpage control (2023-08-15),

11. 11557525 - Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements (2023-01-17),

12. 11404288 - Semiconductor device packaging warpage control (2022-08-02),

13. 11335652 - Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide (2022-05-17),

14. 11222790 - Tie bar removal for semiconductor device packaging (2022-01-11),

15. 11121467 - Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process (2021-09-14),

Title: Zhiwei Gong: Pioneering Inventor from Chandler, AZ

Introduction: Zhiwei Gong is a highly accomplished inventor based in Chandler, Arizona, known for his groundbreaking innovations in various fields.

Latest Patents: Zhiwei Gong holds several patents in the areas of technology and engineering, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Zhiwei Gong has worked with leading tech companies, contributing significantly to the development of cutting-edge technologies.

Collaborations: Throughout his career, Zhiwei Gong has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and excellence in all his projects.

Conclusion: Zhiwei Gong's passion for innovation and his relentless drive to create have solidified his position as a prominent figure in the world of inventors, inspiring the next generation of innovators to dream big and push the limits of what is possible.

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18 patents pending:

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2 patents pending (EPO):

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