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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Zhiwei Gong

This inventor holds 59 USPTO granted patents and 19 published patent applications, primarily in Semiconductor Packaging. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc., Nxp B.v.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhiwei Gong. Retrieved from https://idiyas.com/inventor/zhiwei-gong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 59 

% Patents Active = 89.8

Average Co-Inventor Count = 3.6

ph-index = 9

Forward Citations = 254(Granted Patents)

Forward Citations (Not Self Cited) = 222(Dec 10, 2025)


Location History:

  • Tianjin, CN (2015)
  • Tempe, AZ (US) (2018)
  • Austin, TX (US) (2018 - 2020)
  • Chandler, AZ (US) (2012 - 2024)

Company Filing History:

goldMedal36 out of 2,851 
 
Nxp USA, Inc.
 patents
silverMedal20 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
bronzeMedal2 out of 5,325 
 
Nxp B.v.
 patents
4. 1 out of 834,513 
Other
 patents

Years Active: 2012-2026

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Areas of Expertise:
3D Integration
Thermal Dissipation
Multichip Packages
EMI Shielding
Microelectronic Devices
Wafer Level Packages
Embedded Electronic Devices
Through Package Via
Molded Packages
Signal Integrity
Additive Manufacturing
Interconnect Structures
59 patents (USPTO):Explore Patents
1. 12740418 - Semiconductor device packaging warpage control (2026-09-15),
2. 12628685 - Double-sided multichip packages with direct die-to-die coupling (2026-05-12),
3. 12622280 - Semiconductor device with through package via and method therefor (2026-05-05),
4. 12588557 - Multichip packages with 3D integration (2026-03-24),
5. 12557221 - Molded packages with through-mold interconnects (2026-02-17),
6. 12538844 - Double-sided multichip packages (2026-01-27),
7. 12406896 - Semiconductor device package having thermal dissipation feature and method therefor (2025-09-02),
8. 12387985 - Semiconductor device with cavity carrier and method therefor (2025-08-12),
9. 12184237 - Surface-mount amplifier devices (2024-12-31),
10. 12125716 - Semiconductor device packaging warpage control (2024-10-22),
11. 12040291 - Radio frequency packages containing multilevel power substrates and associated fabrication methods (2024-07-16),
12. 11967507 - Tie bar removal for semiconductor device packaging (2024-04-23),
13. 11935809 - Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements (2024-03-19),
14. 11817366 - Semiconductor device package having thermal dissipation feature and method therefor (2023-11-14),
15. 11791283 - Semiconductor device packaging warpage control (2023-10-17),

Title: Zhiwei Gong: Pioneering Inventor from Chandler, AZ

Introduction: Zhiwei Gong is a highly accomplished inventor based in Chandler, Arizona, known for his groundbreaking innovations in various fields.

Latest Patents: Zhiwei Gong holds several patents in the areas of technology and engineering, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Zhiwei Gong has worked with leading tech companies, contributing significantly to the development of cutting-edge technologies.

Collaborations: Throughout his career, Zhiwei Gong has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and excellence in all his projects.

Conclusion: Zhiwei Gong's passion for innovation and his relentless drive to create have solidified his position as a prominent figure in the world of inventors, inspiring the next generation of innovators to dream big and push the limits of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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