The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Nov. 01, 2021
Nxp Usa, Inc., Austin, TX (US);
Lu Ll, Gilbert, AZ (US);
Li Ll, Scottsdale, AZ (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Fernando A. Santos, Chandler, AZ (US);
Elie A. Maalouf, Mesa, AZ (US);
Eduard Jan Pabst, Mesa, AZ (US);
NXP USA, Inc., Austin, TX (US);
Abstract
A device includes a package body including a central flange and an amplifier module mounted to the central flange of the surface-mount device. The amplifier module includes a module substrate mounted to the central flange. The module substrate includes a first die mount window, a first circuitry on a first surface of the module substrate, a second circuitry on the first surface of the module substrate, and a first amplifier die mounted on the central flange. The first amplifier die is at least partially disposed within the first die mount window and the first amplifier die is electrically connected to the first circuitry and the second circuitry. The first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.