Fernando A Santos

This inventor holds 31 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc.. Active years: 2014-2025.

USPTO Granted Patents = 31 (Patent Applications = 5)

% Patents Active = 96.8

EPO Patents = 1 (Patent Applications = 3)

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 79(Granted Patents)

Location History:

Austin, TX (US) (2016)
Chandler, AZ (US) (2014 - 2024)

Company Filing History:

Freescale Semiconductor,inc.

patents

Years Active: 2014-2025

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Areas of Expertise:

Circuit Modules

Surface-Mount Amplifier Devices

Radio Frequency Packages

Leadless Power Amplifier Packages

Thermal Dissipation Structures

Semiconductor Packaging

Molded Air Cavity Packages

Isolation Walls

Multi-Chip Structures

Decoupling Capacitors

Wafer Dicing

Top Terminations

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12446158 - Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules (2025-10-14),

2. 12184237 - Surface-mount amplifier devices (2024-12-31),

3. 12040291 - Radio frequency packages containing multilevel power substrates and associated fabrication methods (2024-07-16),

4. 11984429 - Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof (2024-05-14),

5. 11621231 - Methods of fabricating leadless power amplifier packages including topside terminations (2023-04-04),

6. 11581241 - Circuit modules with front-side interposer terminals and through-module thermal dissipation structures (2023-02-14),

7. 11437276 - Packaged dies with metal outer layers extending from die back sides toward die front sides (2022-09-06),

8. 11343919 - Packaged electronic devices with top terminations (2022-05-24),

9. 11342275 - Leadless power amplifier packages including topside terminations and methods for the fabrication thereof (2022-05-24),

10. 10741446 - Method of wafer dicing for wafers with backside metallization and packaged dies (2020-08-11),

11. 10630243 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2020-04-21),

12. 10529638 - Molded air cavity packages and methods for the production thereof (2020-01-07),

13. 10476442 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2019-11-12),

14. 10396006 - Molded air cavity packages and methods for the production thereof (2019-08-27),

15. 10375833 - Methods of manufacturing packaged electronic devices with top terminations (2019-08-06),

Title: The Innovative Journey of Fernando A Santos

Introduction: Fernando A Santos, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his creative innovations and patented inventions.

Latest Patents: Fernando A Santos holds several patents in the areas of renewable energy technologies, smart home devices, and advanced medical equipment, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a background in engineering and a passion for problem-solving, Fernando A Santos has successfully brought several groundbreaking ideas to life, revolutionizing industries and improving the lives of many.

Collaborations: Throughout his career, Fernando A Santos has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions, demonstrating his commitment to innovation and excellence.

Conclusion: Fernando A Santos continues to inspire the next generation of inventors with his remarkable achievements and unwavering dedication to pushing the boundaries of what is possible in the world of technology.