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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Fernando A Santos

This inventor holds 31 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc.. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fernando A Santos. Retrieved from https://idiyas.com/inventor/fernando-a-santos

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 96.8

 

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 79(Granted Patents)


Location History:

  • Austin, TX (US) (2016)
  • Chandler, AZ (US) (2014 - 2024)

Company Filing History:

goldMedal20 out of 2,851 
 
Nxp USA, Inc.
 patents
silverMedal11 out of 5,491 
 
Freescale Semiconductor,inc.
 patents

Years Active: 2014-2025

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Areas of Expertise:
Circuit Modules
Leadless Power Amplifiers
RF Amplifier Devices
Molded Air Cavity Packages
Surface-Mount Devices
Multilevel Power Substrates
Top Terminations
Wafer Dicing
Isolation Walls
Thermal Dissipation
Die Packaging
Electromagnetic Coupling
31 patents (USPTO):Explore Patents
1. 12446158 - Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules (2025-10-14),
2. 12184237 - Surface-mount amplifier devices (2024-12-31),
3. 12040291 - Radio frequency packages containing multilevel power substrates and associated fabrication methods (2024-07-16),
4. 11984429 - Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof (2024-05-14),
5. 11621231 - Methods of fabricating leadless power amplifier packages including topside terminations (2023-04-04),
6. 11581241 - Circuit modules with front-side interposer terminals and through-module thermal dissipation structures (2023-02-14),
7. 11437276 - Packaged dies with metal outer layers extending from die back sides toward die front sides (2022-09-06),
8. 11343919 - Packaged electronic devices with top terminations (2022-05-24),
9. 11342275 - Leadless power amplifier packages including topside terminations and methods for the fabrication thereof (2022-05-24),
10. 10741446 - Method of wafer dicing for wafers with backside metallization and packaged dies (2020-08-11),
11. 10630243 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2020-04-21),
12. 10529638 - Molded air cavity packages and methods for the production thereof (2020-01-07),
13. 10476442 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2019-11-12),
14. 10396006 - Molded air cavity packages and methods for the production thereof (2019-08-27),
15. 10375833 - Methods of manufacturing packaged electronic devices with top terminations (2019-08-06),

Title: The Innovative Journey of Fernando A Santos

Introduction: Fernando A Santos, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his creative innovations and patented inventions.

Latest Patents: Fernando A Santos holds several patents in the areas of renewable energy technologies, smart home devices, and advanced medical equipment, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a background in engineering and a passion for problem-solving, Fernando A Santos has successfully brought several groundbreaking ideas to life, revolutionizing industries and improving the lives of many.

Collaborations: Throughout his career, Fernando A Santos has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions, demonstrating his commitment to innovation and excellence.

Conclusion: Fernando A Santos continues to inspire the next generation of inventors with his remarkable achievements and unwavering dedication to pushing the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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