The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Dec. 12, 2022
Nxp Usa, Inc., Austin, TX (US);
Zhiwei Gong, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
Michael B. Vincent, Chandler, AZ (US);
Betty Hill-Shan Yeung, Chandler, AZ (US);
Rushik P. Tank, Tempe, AZ (US);
Kabir Mirpuri, Scottsdale, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.