Chandler, AZ, United States of America

Rushik Prabhudas Tank

USPTO Granted Patents = 6 

Average Co-Inventor Count = 5.6

ph-index = 1


Location History:

  • Chandler, AZ (US) (2022 - 2024)
  • Tempe, AZ (US) (2024)

Company Filing History:


Years Active: 2022-2025

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6 patents (USPTO):

Title: Innovations of Rushik Prabhudas Tank

Introduction

Rushik Prabhudas Tank is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of semiconductor technology. With a total of six patents to his name, he has demonstrated a strong commitment to innovation and advancement in his area of expertise.

Latest Patents

Among his latest patents is a "Semiconductor device package having thermal dissipation feature and method therefor." This invention provides a semiconductor device package that includes a package substrate, with a semiconductor die mounted on its first surface. A thermal conductive structure, which includes a die pad portion, is affixed to the semiconductor die, allowing for efficient thermal management. Another significant patent is "Tie bar removal for semiconductor device packaging." This method involves forming a leadframe that includes a tie bar and a flag, with the tie bar extending from a side rail of the leadframe. The process allows for the effective encapsulation of the semiconductor die and the leadframe, enhancing the overall packaging efficiency.

Career Highlights

Rushik is currently employed at NXP USA, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing innovative solutions that address the challenges faced in the industry.

Collaborations

He collaborates with talented individuals such as Zhiwei Gong and Scott M Hayes, contributing to a dynamic and innovative work environment.

Conclusion

Rushik Prabhudas Tank's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor packaging and thermal management.

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