The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2026
Filed:
Sep. 08, 2022
Nxp Usa, Inc., Austin, TX (US);
Michael B. Vincent, Chandler, AZ (US);
Scott M. Hayes, Chandler, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Leo Van Gemert, Nijmegen, NL;
Antonius Hendrikus Jozef Kamphuis, Nijmegen, NL;
Wen Hung Huang, Kaosiung, TW;
NXP USA, INC., Austin, TX (US);
Abstract
A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.