The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Jun. 01, 2021
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Lu Li, Gilbert, AZ (US);
Sharan Kishore, Tempe, AZ (US);
Freek Egbert van Straten, Mook, NL;
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/433 (2013.01); H01L 23/3736 (2013.01); H01L 23/4006 (2013.01); H01L 2023/405 (2013.01);
Abstract
A thermal interface structure for transferring heat from an electronic component to a system heat sink includes a stack of one or more layers of a stiff thermal interface material and one or more layers of a compliant thermal interface material stacked on and connected to the one or more layers of the compliant thermal interface material. In some embodiments, the thermal interface structure also may include one or more layers of a shape memory alloy and/or a collapsible encasement.